Non-volatile semiconductor memory

ABSTRACT

A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has a first latch and a second latch that are selectively connected to the memory cell array and transfer data each other. A controller controls the reprogramming and retrieval circuits on data-reprogramming operation to and data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches in storing the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims benefit of priority under 35 USC §119 toJapanese Patent Applications Nos. 2000-63798 and 2000-323199 filed onMar. 8, 2000 and Oct. 23, 2000, respectively, in Japan, the entirecontents of which are incorporated by reference herein.

BACKGROUND OF THE INVENTION

The present invention relates to an electrically erasable programmableread-only memory (EEPROM). Particularly, this invention relates to adata-reprogramming/retrieval circuit that temporally stores data to beprogrammed or data to be retrieved for a caching function or amultilevel logical function.

Focused on in the semiconductor industry is reduction of cost per bitfor high-capacity flash EEPROMs used as a file memory by miniaturizationof cell structure with process techniques and also by multilevel logictechniques for high capacity.

FIG. 42 is a circuit block diagram of a data-reprogramming/retrievalcircuit (called a page buffer hereinafter) for a multilevel logicaloperation (four-level logical operation) to store a 2-bit data in onenon-volatile memory cell in a NAND-type flash EEPROM.

The page buffer is provided with a latch 1 connected to a datainput/output terminal I/O via a data input/output buffer 50 a and alatch 2 that is not directly connected to the buffer 50.

Provided on a bit line BLs connecting the latch 1 and a flash memorycell 5 are transfer transistors 42 and 62. Provided on a bit line BLoconnecting the latch 2 and another flash memory cell 5 are transfertransistors 30 and 61.

Transfer transistors 70 and 71, and 80 and 81 are provided on a linecarrying Vdd and a line carrying Vss, respectively.

Provided further are transfer transistors 63 and 64 for transferring apre-charge potential VA and a shield potential VB to the bit lines BLsand BLo, respectively.

The two bit lines BLs and BLo are selectively connected to, or share thepage buffer.

Such a page buffer is disclosed in “A Multipage Cell Architecture forHigh-speed Programming Multilevel NAND Flash Memories”, IEEE J.Solid-State Circuit Circuit, Vol. 33, pages 1228 to 1238, August 1998,K. Takeuchi et al.

Two bits per cell is realized, as illustrated in FIG. 43A in that arelationship between a threshold level distribution for memory cell and2-bit logic data is defined for allocation of the first and the secondbits to different row addresses, thus achieving programming andretrieval of four-level data to and from one memory cell. The first andthe second bits are the upper and the lower bits, respectively, of thetwo bits, such as, “1”, and “0”, respectively, of “10”.

In programming of the second bit-data, data to be programmed andcorresponding to the second multilevel row address is loaded into thelatch 1 via the data input/output buffer 50.

When the data to be programmed is “0”, programming is performed from a“11”-state to a “10”-state in FIG 43A. On the other hand, when the datato be programmed is “1”, programming is prohibited, so that the“11”-state remains unchanged.

In programming of the first bit-data, as shown in FIG. 44, data to beprogrammed and corresponding to the first multilevel row address isloaded into the latch 1 via the data input/output buffer 50 while thesecond bit-data that has been stored in the memory cell 5 is loaded intothe latch 2.

When the data to be programmed is “0”, programming is performed from the“1”-state to a “01”-state in FIG. 43A when the second-bit data stored inthe latch 2 is “1” whereas from the “10”-state to a “00”-state in FIG.43A when the second-bit data stored in the latch 2 is “0”.

On the other hand, when the first-bit data stored in the latch 1 is “1”,programming is prohibited, so that the threshold level of the second bitis held as it is and both the “11”-and “10”-states remain unchanged.

In this known structure, a 2-bit logic data is stored in onenon-volatile memory cell in which the first-bit data and the second-bitdata are handled as data for the first and the second row addresses,respectively, or two addresses (the first and the second row addresses)are allocated for one memory cell.

In retrieval, a word line selection voltage is set in order of Vr00,Vr01 and Vr10, as shown in FIG. 43A.

Data on the voltages Vr00 and Vr01 are loaded into the latches 1 and 2,respectively. Data on the voltage Vr10 is loaded into the latch 1 sothat, after the bit line is discharged, it is re-charged orre-discharged with the data in the latches 1 and 2 to meet logically.

Disclosed above is an example of a multilevel logical operation. A pagebuffer for such an operation, however, requires at least two latches

Not only high capacity for multilevel logical operation, but alsoenhancement in programming and retrieval speed for flash *EPROM isrequired, for example, as illustrated in FIG. 45A.

In FIG. 45A, a memory cell 100 is divided into cells 100 a and 100 b.After data loading for two pages, the data are programmed in the cells100 a and 100 b simultaneously to enhance the programming unit forhigher effective programming speed. The programming unit is enhanced tofour pages, eight pages, and so on, by dividing the memory cell into a4-divided array, 8-divided array for further higher effectiveprogramming speed.

Increase in the number of cell array division, however, takes a longtime to load data for each increase in data unit to be programmed. Forexample, 1-page (512 bytes) and 4-page data loading at 1-byte data inputcycle of 50 ns take about 25 μs and 100 μs, respectively. Oneprogramming takes about 200 μs.

The effective programming speed is enhanced with four-fold simultaneousprogramming unit, on the other hand, the next successive 4-pageprogramming has to wail for about 100 μs that corresponds to 4-page dataloading.

Moreover, increase in the number of cell array division requires a largechip and causes high consumption of power.

As discussed above, higher capacity and also higher programming speedare expected for flash EEPROMs.

A programming time in multilevel operation is longer several times thanthat in two-level operation for storing 1-bit data to one non-volatilememory cell. In multilevel operation, a programming time takes long muchmore than a data load tine, thus increase in data amount to beprogrammed at once by cell array division serves to enhance an effectiveprogramming speed.

Enhancement in effective programming speed only by cell array divisiontakes a long data load time in two-level operation thus inefficient.

SUMMARY OF THE INVENTION

A purpose of the present invention is to provide a non-volatilesemiconductor apparatus having a multilevel function for large storagecapacity and a caching function for high-speed data load time.

The present invention provides a non-volatile semiconductor devicecomprising, a memory cell array having electrically erasableprogrammable non-volatile memory cells; a plurality of reprogramming andretrieval circuits that temporarily store data to be programmed in thememory cell array and sense data retrieved from the memory cell array,each reprogramming and retrieval circuit having a first latch and asecond latch that are selectively connected to the memory cell array andtransfer data each other; and a controller that controls thereprogramming and retrieval circuits on data-reprogramming operation toand data-retrieval operation from the memory cell array, wherein eachreprogramming and retrieval circuit has a multilevel logical operationmode and a caching operation mode, in the multilevel logical operationmode, re-programming and retrieval of upper and lower bits of two-bitfour-level data being performed using the first and the second lathes instoring the two-bit four-level data in one of the memory cells in apredetermined threshold level range, in the caching operation mode, datatransfer between one of the memory cells selected in accordance with afirst address and the first latch being performed while data transfer isbeing performed between the second latch and input/output terminals inaccordance with a second address with respect to one-bit two-level datato be stored in one of the memory cells.

According to the present invention, each reprogramming and retrievalcircuit has two latches enabling a caching function for flash EEPROMsfor attaining high-speed programming speed and a multilevel functionflash EEPROMs for attaining large storage capacity.

The multilevel logical operation mode and the caching operation mode maybe switched by command entry. Or, they may be executed as beingpartially overlapped each other in accordance with an address of thedata.

Moreover, the present invention provides a non-volatile semiconductordevice comprising: a memory cell array having electrically erasableprogrammable non-volatile memory cells; a plurality of reprogramming andretrieval circuits that temporarily store data to be programmed in thememory cell array and sense data retrieved from the memory cell array,each reprogramming and retrieval circuit having a first latch and asecond latch, the first latch being connected to a selected hit line ofthe memory cell array via a first transfer switch and a second transferswitch series-connected to each other, the second latch being connectedto a connection node of the first and the second transfer switches via athird transfer switch, a data node of the second latch being connectedto data input and output lines via column selection switches; and acontroller that controls the reprogramming and retrieval circuits ondata-reprogramming operation to and data-retrieval operation from thememory cell array.

This connection of the first and the second latches attains both thecaching and multilevel functions.

After the data has been programmed in a selected memory cell, theprogrammed data may be retrieved for programming verification, theretrieved data being sensed and stored in the first latch.

Each reprogramming and retrieval circuit may have a multilevel logicaloperation mode and a caching operation mode. In the multilevel logicaloperation mode, reprogramming and retrieval of upper and lower bits oftrio-bit four-level data are performed using the first and the secondlathes in storing the two-bit four-level data in one of the memory cellsin a predetermined threshold level range. In the caching operation mode,data transfer between one of the memory cells selected in accordancewith a first address and the first latch is performed while datatransfer is being performed between the second latch and input/outputterminals in accordance with a second address with respect to one-himtwo-level data to be stored in one of the memory cells.

The four-level data nay be defined as “11”, “10”, “00” and “01” fromlower level of the threshold level range. Different row addresses may beallocated to the upper and the lower bits of the four-level data forprogramming and retrieval.

A first and a second data programming operation may be performed in themultilevel logical operation mode. In the first data programmingoperation, the lower-bit data is loaded into the second latch and thenstored in the first latch, programming being performed to a selectedmemory cell based on the data stored in the first latch, In the seconddata programming operation, the upper-bit data is loaded into the secondlatch and then stored in the first latch while lower-bit data alreadyprogrammed in the selected memory cell is being retrieved and loadedinto the second latch, programming being performed to the selectedmemory cell based on the data stored in the first latch in accordancewith the data stored in the second latch.

Moreover, a first, a second and a third retrieval operation may beperformed in the multilevel logical operation mode. In the firstretrieval operation, “0” or “1” of the upper bit is judged using aretrieval voltage applied at a control gate of a selected memory cell,the retrieval voltage being set in a threshold level range of “10” and“00” as the four-level data. In the second retrieval operation, “0” or“1” of the lower bit when the upper bit is “0” is judged using aretrieval voltage applied at the control gate of the selected memorycell, the retrieval voltage being set in a threshold level range of “00”and “01” as the four-level data. In the third retrieval operation, “0”or “1” of the lower bit when the upper bit is “1” is judged using aretrieval voltage applied at the control gate of the selected memorycell, the retrieval voltage being set in a threshold level range of “11”and “10” as the four-level data.

Each reprogramming and retrieval circuit may be selectively connected toa plurality of bit lines of the memory cell array via a bit lineselection switch. Each reprogramming and retrieval circuit may have acoon signal line connected to the connection node of the first and thesecond transfer switches via a fourth transfer switch. Or, eachreprogramming and retrieval circuit may have a temporal storing node fortemporarily storing a potential at a data node of the first latch and afifth transfer switch provided between the fourth transfer switch andthe common signal line, the fifth transfer switch being controlled bythe potential at the temporal storing node.

Furthermore, the present invention provides a nonvolatile semiconductordevice comprising: a memory cell array having electrically erasableprogrammable non-volatile memory cells; a plurality of reprogramming andretrieval circuits that temporarily store data to be programmed in thememory cell array and sense data retrieved from the memory cell array,each reprogramming and retrieval circuit having a first latch and asecond latch that are selectively connected to the memory cell array andtransfer data each other; and a controller that controls thereprogramming and retrieval circuits on data-reprogramming operation toand data-retrieval operation from the memory cell array, wherein eachreprogramming and retrieval circuit has a caching operation mode inwhich data transfer between one of the memory cells selected inaccordance with a first address and the first latch being performedwhile data transfer is being performed between the second latch andinput and output terminals in accordance with a second address withrespect to two-level data to be stored in one of the memory cells.

The cooperation of the first and the second latches offers a high-speedEEPROM having a caching function.

A data programming cycle for a selected memory cell of the memory cellarray may be performed by repeated programming pulse application andretrieval for programming verification, in a test mode, a cell currentflowing in the selected memory cell being retrieved to the input andoutput terminals while the data programming cycle being interruptedduring which the data retrieved by the retrieval for programmingverification is being stored in the first latch and the second latch isbeing inactive.

A test mode for measuring the cell current during programming can beused for various analysis.

Moreover, the present invention provides a non-volatile semiconductordevice comprising: a memory cell array having non-volatile memory cells,data being stored in a selected non-volatile memory cell in accordancewith existence of a current flowing through the selected cell or a levelof the an current; and a sense amplifier circuit for retrieving the dataon the selected bit line, the sense amplifier circuit including: a sensenode connected to the selected bit line via a clamp transistor; apre-charging circuit for pre-charging the bit line via the clamptransistor connected to the sense node; an inverter having an inputterminal connected to the sense node via transfer transistor; and aboosting capacitor, one of terminals thereof being connected to thesense node, the capacitor boosting a potential at the sense node usingthe other terminal as a drive terminal.

The boosting capacitor controls the potential at the sense node whiledata on a bit line is being sensed, thus precisely adjusting two-leveldata “HIGH” and “LOW” retrieved at the sense node with respect to thethreshold level of the sense amplifier for attaining wide margin ofsensing.

The sense amplifier circuit may perform bit line-data sensing with sensenode-potential boosting by the boosting capacitor as follows: (a)pre-charging the bit line through the pre-charging circuit while theclamp transistor is being turned on, (b) continuously precharging thesense node while the clamp transistor is being turned of f andpre-charging circuit is being turned on during which a potential on thepre-charged bit line is varying in accordance with data stored in aselected nonvolatile memory cell, (c) turning off the pre-chargingcircuit to drive the boosting capacitor, while applying a firstpotential to the drive terminal, to boost the potential at the sensenode, and (d) applying a retrieval voltage to a gate of the clamptransistor to transfer the data on the bit line to the sense node. After(d), it is preferable to (e) lower the retrieval voltage but higher thana threshold level of the clamp transistor and then stops boosting thesense node by applying a second potential to the drive terminal of theboosting capacitor, the second potential being lower than the firstpotential.

These sequential sensing operations with potential boosting achieveaccurate data judgement with no relation to variation in senseamplifier-threshold level by lowering data level “LOW” retrieved at thesense if it is not sufficiently low due to high turn-on resistance of aselected memory cell. Furthermore, lowering a retrieval voltage at theclamp transistor after data transfer prevents the potential at the sensenode from going to a negative level, as a result of potential boosting,for retrieving originally sufficiently low level “LOW”.

Moreover, the present invention provides a non-volatile semiconductordevice comprising: a memory cell array having non-volatile memory cells,data being stored in a selected non-volatile memory cell in accordancewith existence of a current flowing through the selected cell or a levelof the current; and a sense amplifier circuit for retrieving the data onthe selected bit line, the sense amplifier circuit including: a sensenode connected to the selected bit line via a clamp transistor; apre-charging circuit for pre-charging the bit line via the clamptransistor connected to the sense node; a sense transistor, a sourcethereof being supplied with a reference potential; a latch having a datanode connected to a drain of the sense a transistor via transfertransistor; and a boosting capacitor, one of terminals thereof beingconnected to The sense node, the capacitor boosting a potential at thesense node using the other terminal as a drive terminal.

The sense amplifier circuit having the sense transistor provided betweenthe latches and sense node and connected to the sense node is providedwith the boosting capacitor also connected to the sense node. Theboosting capacitor controls the potential at the sense node during bitline-data sensing, thus attaining wide margin of sensing. The sensingoperation may be executed with the sequential sensing operations (a) to(d) or (a) to (e), as disclosed above.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram of the first preferred embodiment of aNAND-type flash EEP:TOM according to the present invention;

FIG. 2 shows a circuit diagram of a page buffer (a reprogramming andretrieval circuit) in the first embodiment;

FIG. 3 illustrates the connection between the page buffer and the memorycell array in the first embodiment;

FIG. 4 illustrates data transfer performed by the page buffer in thefirst embodiment;

FIG. 5 illustrates programming and retrieval performed by the pagebuffer in the first embodiment;

FIG. 6 illustrates re-charging in retrieval for programming verificationperformed by the page buffer in the first embodiment;

FIG. 7 illustrates internal data loading in multilevel operation modeand bit line pre-charging in Verify00 performed by the page buffer inthe first embodiment;

FIG. 8 illustrates second retrieval in multilevel operation modeperformed by the page buffer in the first embodiment;

FIG. 9A is a flow chart of the second-bit data programming in multileveloperation in the first embodiment;

FIG. 9B is a flow chart of the first-bit data programming in multileveloperation in the first embodiment;

FIG. 10A illustrates timing of data transfer from the second latch 2 ato the first latch 1 a in the first embodiment;

FIG. 10B illustrates timing of data transfer from the first latch 1 a tothe second latch 2 a in the first embodiment;

FIG. 11 illustrates timing of programming pulse application in which thesolid line indicates “0”-programming to “1”-programmed cell in the firstembodiment;

FIG. 12A illustrates erasure in memory cell in the first embodiment;

FIG. 12B illustrates programming in memory cell in the first embodiment;

FIG. 13 illustrates timing of retrieval “Verify10” for programmingverification in which the solid line indicates programming failure in“10 ”-programming to “11”-programmed cell in the first embodiment;

FIG. 14 illustrates programming voltage waveform on selected word linein the first embodiment;

FIG. 15A illustrates data transfer from the second latch 2 a to thefirst latch 1 a in the first embodiment;

FIG. 15B illustrates internal data loading in the first embodiment;

FIG. 16 illustrates riming of internal data loading in which the solidline indicates retrieval from “11”-programmed cell in the firstembodiment;

FIG. 17 illustrates timing of retrieval “Verify00” for programmingverification in which the solid line indicates programming failure in“0”-programming to the first (upper) bit in which “00”-programmed cellare programmed with “00” in the first embodiment;

FIG. 18 illustrates timing of retrieval “Verify01” for programmingverification in which the solid line indicates programming failure in“0”-programming to the first (upper) bit in which “11”-stored cells areprogrammed with “01” in the first embodiment;

FIG. 19A is a flow chart of the second-bit data retrieval in multileveloperation in the first embodiment;

FIG. 19B is a flow chart of the first-bit data retrieval in multileveloperation in the first embodiment;

FIG. 20 illustrates timing of retrieval “Read00” in which the solid lineindicates retrieval from “10”- or “11”-programmed cell in the firstembodiment;

FIG. 21 illustrates timing of retrieval “Read01” in which the solid lineindicates retrieval from “00”-“10”- or “11”-programmed cell in the firstembodiment;

FIG. 22 illustrates timing of retrieval “Read10” in which the solid lineindicates retrieval from “01”-programmed cell in the first embodiment;

FIG. 23 illustrates data and threshold level in 1-bit cell in two-leveloperation;

FIG. 24A illustrates retrieval from one memory cell array using cachememory in the first embodiment;

FIG. 24B illustrates retrieval from two memory cells array using cachememory in the first embodiment;

FIG. 25A illustrates programming using cache memory in the firstembodiment;

FIG. 25B illustrates programming from two memory cell array (double inpage capacity) using cache memory in the first embodiment;

FIG. 25C illustrates programming from one memory cell array using cachememory in the first embodiment;

FIG. 26 illustrates timing of data transfer with latch (2 a) resettingin the second embodiment;

FIG. 27 illustrates programming using cache memory in the secondpreferred embodiment of a NAND-type flash EEPROM according to thepresent invention;

FIG. 28A illustrates data transfer using cache memory in multileveloperation;

FIG. 28B illustrates data transfer using cache memory in multileveloperation;

FIG. 29 illustrates programming using cache memory in multileveloperation;

FIG. 30 shows a circuit diagram of a page buffer (a reprogramming andretrieval circuit) in the fourth preferred embodiment of a NAND-typeflash EEPROM according to the present invention;

FIG. 31A illustrates signal waveforms in known test mode;

FIG. 31B illustrates signal waveforms in test mode (cell currentmeasurement during programming) in the fifth preferred embodiment of aNAND-type flash EEPROM according to the present invention;

FIG. 32 shows potential change in “0”-programming at the second (lower)bit in which “11”-stored cells are programmed with “10”, the same for 1bit-stored cells in the first embodiment;

FIG. 33 shows potential change in “1”-programming at the second (lower)bit in which “11”-stored cells are programmed with “11” (programmingprohibition), the same for 1 bit-stored cells in the first embodiment;

FIG. 34 shows potential change in “0”-programming to the first (upper)bit in which “11”-stored cells are programmed with “01” in the firstembodiment;

FIG. 35 shows potential change in “0”-programming to the first (upper)bit in which “10”-stored cells are programmed with “00” in the firstembodiment;

FIG. 36 shows potential change in “1”-programming to the first (upper)bit in which “11”-stored cells are programmed with “11” in the firstembodiment;

FIG. 37 shows potential change in “1”-programming to the first (upper)bit in which “10”-stored cells are programmed with “10” in the firstembodiment;

FIG. 38 indicates potential change in the first (upper) bit retrieval inmultilevel operation (in which a selected word line level is Vr0 notVr00 for two-level operation with the second latch 2 a as a cachememory) in the first embodiment;

FIG. 39 shows potential change in the first time-second (lower) bitretrieval in multilevel operation in the first embodiment;

FIG. 40 shows potential change in the second time-second (lower) bitretrieval when the node N1 is at “HIGH” in the first time-retrieval inmultilevel operation in the first embodiment;

FIG. 41 shows potential change in the second time-second (lower) bitretrieval when the node N1 is at “LOW” in the first time-retrieval inmultilevel operation in the first embodiment;

FIG. 42 shows a known flash memory;

FIG. 43A illustrates data and threshold level distribution;

FIG. 43B illustrates data and threshold level distribution in thepresent invention;

FIG. 44 illustrates known data loading in multilevel operation;

FIG. 45A illustrates known relationship between memory cell array andpage buffer;

FIG. 45B illustrates the relationship between memory cell array and pagebuffer in the present invention;

FIG. 46 shows a circuit diagram of a page buffer (a reprogramming andretrieval circuit) in the sixth preferred embodiment of a NAND-typeflash EEPROM according to the present invention;

FIG. 47A is a flow chart of the second-bit data retrieval in multileveloperation in the sixth embodiment;

FIG. 47B is a flow chart of the first-bit data retrieval in multileveloperation in the sixth embodiment;

FIG. 48 shows potential change in “0”-programming to the second (lower)bit in which “11”-stored cells are programmed with “10” (the same for1-bit cell) in multilevel operation in the sixth embodiment;

FIG. 49 shows potential change in “11”-programming to the second (lower)bit in which “11”-stored cells are programmed with “11” (programmingprohibition, the same for 1-bit cell) in multilevel operation in thesixth embodiment;

FIG. 50 shows potential change in internal data loading in multileveloperation in the sixth embodiment;

FIG. 51 shows potential change in “0”-programming to the first bit inwhich “11”-stored cells are programmed with “01” in multileveloperation;

FIG. 52 shows potential change in “0”-programming to the first (upper)bit in which “10”-stored cells are programmed with “00” in multileveloperation in the sixth embodiment, in which the singe “※” indicates thatcells failed in “Verify00” will be failed in “Verify011”;

FIG. 53 shows potential change in “1”-programming to the first (upper)bit in which “11”-stored cells are programmed with “11” in multileveloperation in the sixth embodiment, in which the singe “※” indicates thata selected bit line will be dis-charged through “11”-programmed cell;

FIG. 54 shows potential change in “1”-programming to the first (upper)bit in which “10”-stored cells are programmed with “10” in multileveloperation in the sixth embodiment, in which the singe “※” indicates thata selected bit line will be dis-charged through “11”-programmed cell;

FIG. 55 shows potential change in the first (upper) bit retrieval inmultilevel operation (in which a selected word line level is Vr0 notVr00 for two-level operation with the second latch 2 a as a cachememory) in the sixth embodiment;

FIG. 56 shows potential change in the first time-second (lower) bitretrieval in multilevel operation in the sixth embodiment;

FIG. 57 shows potential change in the second time-second (lower) bitretrieval when the node N1 is at “LOW” for “11”-programmed cell in thefirst time-retrieval in multilevel operation in the sixth embodiment;

FIG. 58 shows potential change in the second time-second (lower) bitretrieval when the node N1 is at “HIGH” for “10”-“00” or “01”-programmedcells in the first time-retrieval in multilevel operation in the sixthembodiment;

FIG. 59 illustrates signal waveforms in data retrieval;

FIG. 60 shows a circuit diagram of the first modification to senseamplifier according to the present invention;

FIG. 61 is a block diagram of a flash UPROM using the sense amplifiershown in FIG. 60;

FIG. 62 illustrates signal waveforms in the sense amplifier shown inFIG. 60;

FIG. 63 shows a circuit diagram of the second modification to senseamplifier according to the present invention;

FIG. 64 shows a circuit diagram of the third modification to senseamplifier according to the present invention;

FIG. 65 illustrates signal waveforms in the sense amplifier shown inFIG. 64;

FIG. 66 shows a circuit diagram of the fourth modification to senseamplifier according to the present invention;

FIG. 67 illustrates signal waveforms in the sense amplifier shown inFIG. 66;

FIG. 68 shows a circuit diagram of the fifth modification to senseamplifier according to the present invention;

FIG. 69 illustrates signal waveforms in the sense amplifier shown inFIG. 68; and

FIGS. 70A to 70C illustrate capacitors used in the foregoingmodifications.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

One of the concepts of the present invention is to mask a long data loadtime taken for known ERPROMS, which is caused in enhancing effectiveprogramming speed only by cell array division as has been discussed.

For example, the present invention uses two caches as illustrated inFIG. 45B for masking such a long data load time.

FIG. 45B illustrates caches (data registers) 140 b 1 and 140 b 2connected to page buffers 140 a 1 and 140 a 2, respectively, for loadingthe next data to be programmed during programming of the preceding data.

The caches 140 b 1 and 140 b 2 may have functions of data transfer toand tram the data input/output terminal I/O while the page buffers 140 a1 and 140 a 2 are performing data programming or retrieval, storing datastably and also data transfer to and from the page buffers 140 a 1 and140 a 2.

The other concept of the present invention is to realize multilevelfunction for large storage capacity.

As shown in FIG. 42, two latches are required for eachdata-reprogramming/retrieval circuit for multilevel function.

In order to realize the caching function as one of the purposes of thepresent invention, since a cache is connected to each page buffer, eachdata-reprogramming/retrieval circuit has two latches. The presentinvention provides a non-volatile semiconductor memory includingdata-reprogramming/retrieval circuit each having two latches to realizeboth multilevel and caching functions and further large storage capacityand high-speed reprogramming/retrieval performance.

Several preferred embodiments to attain the basic structure illustratedin FIG. 45B according to the present invention will be disclosed withreference to the attached drawings.

(First Preferred Embodiment)

FIG. 1 is a block diagram of the first preferred embodiment of aNAND-type flash EEPROM according to the present invention.

A memory cell array 100 is provided with NAND cell units NU0, NU1, NU2,. . . , and NUn each having a plurality of (16 in FIG. 3)series-connected electrically erasable programmable non-volatile memorycells MC0 to MC15 having a stacked gate structure.

For each NAND cell unit NU, the drain is connected to a bit line BL viaa gate selection transistor SG1 and the source is connected to a commonsource line CELSRC via a gate selection transistor SG2.

The control gates of the memory cells MC aligned in the direction of roware all connected to a word line WL. The gate electrodes of the gateselection transistors SG1 and SG2 are connected to gate selection linesSGD and SGS, respectively, provided in parallel to the word lines WL.

A region of memory cells selected through one word line WL correspondsto one page, a unit of data programming and retrieval. Moreover, aregion of NAND cell units NU corresponding to one page or integralmultiples of one page is one block, a unit of data erasure.

A data reprogramming/retrieval circuit 140 (called a page bufferhereinafter) is provided with a sense-amplifier (SA)/latch (DL) for eachbit line BL, for data programming/retrieval per page.

A memory cell array 100 shown in FIG. 3 has a simple structure in whichthe page buffer can be shared by a plurality of bit lines BL for whichthe number of bit lines BL that are selectively connected to the pagebuffer for data programming/retrieval corresponds to the unit of onepage.

FIG. 3 illustrates the region of cell arrays to and from which datatransfer is performed between one data input/output terminal I/O.

In FIG. 1, a row decoder 120 and a column decoder 150 are provided forselection of word lines WL and bit lines BL, respectively, of the memorycell array 100. A controller 110 performs sequence control of dataprogramming, retrieval and erasure. A voltage booster 130 controlled bythe controller 110 generates boosted high or intermediate voltages fordata programming, retrieval and erasure.

A data input/output buffer 50 a is used for input/output of data andaddress signals. In detail, data transfer is performed between theinput/output terminals I/O0 to I/O7 and the data programming/retrievalcircuit 140, An address signal input via terminals I/O is once stored inan address register 180 and then sent to the row and column decoders 120and 150 for decoding.

An operation control command is also input via the terminals I/O. Thecommand is decoded by the data input/output buffer 50 a and stored in acommand register 170 for control of the controller 110.

External command signals, such as, a chip enable signal CED, a commandlatch enable signal CLE, an address latch enable signal LE, aprogramming enable signal WEB and a retrieval enable signal REB, aresent to an operation logic controller 190 for generation of internalcontrol signals according to operation modes. The internal controlsignals are sent to the input/output data buffer 50 a for data latch,transfer, and so on, and also to the controller 110 for operationcontrol.

A ready/busy register 210 generates a R/BB signal that indicates whetherthe EEPROM chip is in a ready or busy state.

The page buffer 140 has a multilevel function and also a cachingfunction both being switched.

The page buffer 140 may be switched to the caching function for storing1-bit two-level data to one memory or even when restricted by addresses.Or, it is switched to the multilevel function for storing 2-bitfour-level data to one memory cell.

FIG. 2 shows a circuit diagram of the page buffer 140 for the multileveland caching functions.

In FIG. 2, two bit lines BLe and BL0 are selectively connected to thepage buffer 140. In detail, a bit selection signal BLTRe or BLTRo turnson an NMOS transistor 60 or 61 (bit line selection transistor) toconnect either the bit line BLe or BL0 to the page buffer 140.

While either of the bit line BLe or BL0 is being selected, the other bitline (not selected) is grounded to a GND potential or clamped at a Vddpotential for suppressing noises generated between bit lines adjacent toeach other.

Not only NAND-type flash memories, the page buffer 140 is applicable toEEPROMS that are capable of serial input/output of 1-page datacorresponding to a row address and a batch processing for dataprogramming to and retrieving from memory cells. A narrow bit line pitchcauses difficulty in circuit layout of such EEPROMs because thesememories have a fixed layout size for data programming and retrievalcircuits. The page buffer 140 that is shared by a plurality of bit linesovercomes such difficulty and increases flexibility in layout whiledecreasing page buffer layout area.

The page buffer 140 shown in FIG. 2 is provided with a mainreprogramming/retrieval circuit 10 having a first latch 1 a. The pagebuffer 140 also includes a second latch 2 a. The main circuit 10 mainlyserves to data programming. The latch 2 a is a secondary latch for acaching function in two-level operation. While not working as a cache,the latch 2 a supports the main circuit 10 for a multilevel operation.

The first larch 1 a of the main reprogramming/retrieval circuit 10 hasCMOS clocked-inverters CI1 and CI2, the components of each inverterbeing connected in series but in reverse order over the two inverters.

A bit line BL for the memory cell array is connected to a sense node N4via an NMOS transistor 41 (a transfer switching device). The sense nodeN4 is connected to a data latch node N1 of the latch 1 a via an NMOStransistor 42 (a transfer switching device). Also connected to the sensenode N4 is a pre-charging NMOS transistor 47.

The node N1 is connected to a node N3 for storing data at the node N1temporarily via an NMOS transistor 45 (a transfer switching device).Also connected to the node N3 is a pre-charging NMOS transistor 46 and acapacitor 49 for claiming the level at the node N3, one of the terminalsof the capacitor 49 being grounded.

A common signal line COM is shared by page buffers 140 each for one bytein one column. The line COM is connected to the sense node N4 via anNMOS transistor 44 (a transfer switching device) controlled by apotential at the node N3 and also an NMOS transistor 43 (a transferswitching device) controlled by a control signal REG. The line COM isused as a signal line for carrying a supply voltage Vdd for selectivelycharging the node N4 and also for pass/fail judgement (disclosed later)in a programming/erasure-verifying operation.

The second larch 2 a has clocked-inverters CI1 a and CI2 a, thecomponents of each inverter being connected in series but in reverseorder over the two inverters, like the first latch 1 a. The latch 2 ahas two data nodes N5 and N6. The node N5 is connected to a data signalline “io” via a column-gate NMOS transistor 51. The node N6 is connectedto a data line “ion” via a column-gate NMOS transistor 52. Thetransistors 51 and 52 are controlled by a column selection signal CSL.

A pre-charging FMOS transistor 82 is connected to the node 115 forcharging Vdd to the node N5. The node N5 is further connected to thenode N4 of the main reprogramming/retrieving circuit 10 via an NHOStransistor 301 a transfer switching device).

Illustrated in FIG. 3 is the connection between the page buffer 140 andthe data input/output buffer 50 a.

Programming to and retrieving from the NAND-type flash EEPROM isperformed for each 512 bytes for one page simultaneously selected by arow address.

The number of bits allocated to one of the eight data input/outputterminals I/O is 512, which is illustrated in FIG. 3.

When the cell array is divided into several arrays, as shown in FIG. 45B(two in this figure), a portion 140 a having the first latch 1 a in thepage buffer 140 corresponds to a plurality of page buffers (two buffers140 a 1 and 140 a 2 in FIG. 45B), and a portion 140 b corresponds to aplurality of caches (two caches 140 b 1 and 140 b 2 in FIG. 45B).

A programming operation requires 512 page buffers for simultaneouslyprogramming 512-bit data, each data corresponding to a column address,Column addresses are decoded to be signals CSL0 to CSL511 for selectingone of the 512 page buffers in data transfer between the data signalline “io” via NMOS transistor 51 (a column selection device), as shownin FIG. 2.

Basic operations of the page buffer 140 are illustrated in FIGS. 4 to 8.In these figures, some of the components in FIG. 2 are simplified foreasy understanding of the operations.

Programming data in the memory cell 100 (FIG. 1) starts with loadingdata to be programmed to the second latch 2 a through the data lines ioand ion.

A programming operation requires the data to be programmed in the firstlatch 1 a, so that the data stored in the second latch 2 a istransferred to the first latch 1 a.

On the other hand, a retrieving operation requires a retrieved data inthe second latch 2 a for outputting to the data input/output terminalsI/O, so that the data stored in the first latch 1 a is transferred tothe second latch 2 a.

As shown in FIG. 4, the switching devices 42 and 30 (the transfertransistors 42 and 30 in FIG. 2) are turned on for data transfer betweenthe first and the second latches 1 a and 2 a. One of the latches 1 a and2 a that has accepted data is dis-activated before data transfer andthen activated to store the data.

Illustrated in FIG. 5 is data transfer in which data is being programmedto and retrieved from the memory cell 100.

Except a multilevel operation, the main reprogramming/retrieving circuit10 having the first latch 1 a performs programming/retrieving operationcontrol. In detail, the switching device 30 is tuned off while theswitching devices 41 and 42 are turned on for data transfer between thefirst latch 1 a and the bit line BL of the memory cell 100.

FIG. 6 illustrates that the switching devices 42 and 43 (the NMOStransistor 43 in FIG. 2) are only turned on during retrieval for aprogramming verification operation.

This is a verifying function for each bit in a programming operation.Programming of “1” in a cell in a “1”-state (erased state) is prohibitedno matter how many times the programming is performed in which aselected bit line is discharged in verification to retrieve data “1”,which is a programming failure. Programming is passed by discharging thebit line BL and then turning on the switching devices 42 and 43 forre-charging a level “HIGH” to the first latch 1 a. Here, “pass” meanscompletion of a data programming while “failure” means incompleteness ofa data programming.

FIG. 7 illustrates a state in a multilevel operation-mode programmingoperation.

The first and the second larches 1 a and 2 a may temporarily store afirst bit-data to be programmed and a second-bit data to be programmed,respectively, for programming. For retrieving the second-bit data fromthe memory cell 100, the switching device 42 is turned off so that thefirst latch 1 a store the first-bit data, and then the switching devices41 and 30 are turned on to retrieve data from the memory cell 100 to thesecond latch The switching devices 41 and 30 are also turned on forpre-charging the bit line BL from the second latch 2 a in retrieval forprogramming verification after application of programming pulses duringprogramming.

FIG. 8 illustrates a state in a retrieval operation when the secondmultilevel row address (explained later) is selected in a multileveloperation mode. The switching devices 42 and 43 are turned so that thecommon signal line COM is grounded to a GND potential for forciblyupdating data that has been retrieved through the bit line BL, thus datacan be correctly retrieved with respect to the relationship between athreshold level Vt of the memory cell 100 and 2-bit data, as illustratedin FIG. 43B.

A multilevel logic operation in the first embodiment is disclosed indetail.

The first embodiment performs a multilevel logical operation under therelationship between a threshold level Vt of the memory cell 100 and2-bit data, as illustrated in FIG. 43B.

The Vt-data relationship in FIG 43B is different from that in FIG. 43A.The same tact in FIGS. 43A and 43B is that the upper-bit data and thelower-bit data correspond to different row addresses. In detail, only ina multilevel operation, two addresses are prepared for the same cell tobe selected.

Row addresses allocated to the upper and the lower bits are called thefirst row address for multilevel operation and a second row address formultilevel operation, respectively.

In FIG. 43B, the first (upper) bit and the second (lower) bit are thedata in selection of the first row address and the second row addressfor multilevel operation, respectively. For example, the data ““10” iscomposed of the first (upper) bit “1” and the second (lower) bit “0”.

Disclosed first is programming and retrieval for programmingverification in selection of the second row address for multileveloperation.

FIG. 9A is a flow chart of a programming operation in selection of thesecond row address for multilevel operation.

Data to be programmed in selection of the second row address formultilevel operation is loaded into the second latch 2 a (FIG. 2)through the data signal line io/ion (step S11). Data corresponding to acolumn address is also loaded into the second latch 2 a while 512-bytedata for one page are being serially input.

On completion of one-page data loading, the data in the second latch 2 ais transferred to the first latch 1 a (step S12), as illustrated in FIG.10A.

In FIG. 2, a potential BLCD at the gate of the NMOS switching transistor42 and a potential BLCD2 at the gate of the NMOS switching transistor 30are set at a level “HIGH” for carrying Vdd to transfer the data from thesecond latch 2 a to the first latch 1 a. In FIG. 10A, data “HIGH” isstored in the second latch after data loading, thus the node N5 beingset at the level “HIGH” (Vdd).

A programming operation starts after the data transfer described above(step S13).

Illustrated in FIG. 11 is an example of timing in programming pulseapplication.

In FIG. 2, data to be programmed in the first latch 1 a is transferredto a selected bit line via the NMOS transistors 42 and 41, and the bitline selection transistor 60. A voltage high enough for transferring VDDto the bit line BLe has been supplied to the gates of the transistorslocated between the first latch la and the bit line BLe. In thisexample, the bit line BLe, one of the two bit lines BLo and BLe thatshare the one page buffer 140, has been selected, which is the same forthe following disclosure.

The level “HIGH” at the node N1, one of the terminals of the first latchla, allows the level “HIGH” to be transferred to the bit line BLe sothat a selected cell is brought into a programming-prohibited state inwhich data “1”, has been programmed. On the other hand, the level “LOW”at the node N1 brings the selected cell into a state in which data “0”has been programmed.

In FIG. 11, the level “LOW” is transferred to the selected bit line BLe,as indicated by the solid line, to program the data “0” in“11”-programmed cell, so that “10” is programmed in the cell.

The NAND-type flash EEPROM is at a negative threshold level Vt, such as,in “11”-programmed state illustrated in FIG. 43B, in an erased statebefore programming.

In an erasure operation, as illustrated in FIG. 12A, electrons arepulled out from a floating gate 511 of a memory cell at 0V for all theword lines 510 of a selected block and a positive high erasure voltage(about 20V) for a p-well 513 of the memory cell, and in a state asource/drain 512 oaf the memory cell is floating.

In a programming pulse applying operation, as illustrated in FIG. 12B,selected word line 510 is set at a positive high programming voltageVpgm (15 to 20V) while the p-well 513 is grounded to 0V so thatelectrons are injected into the floating gate 511.

Electrons are injected into the floating gate 511 while 0V istransferred to from the first latch 1 a to the bit line BLe due to thefact that a potential difference enough for programming occurs betweenthe channel and the floating gate 511 of the memory cell. Such apotential difference occurs when 0V is transferred to the n-typediffusion layer 512 via the bit line, bit line-side selectiontransistors and also non-selected cells in the cell unit.

On the other hand, electrons are not injected into the floating gate 511while the level “HIGH” is transferred to from the first latch 1 a to theselected bit line BLe due to a small potential difference between thechannel and the floating gate 511 caused by a high channel potential ofa selected memory cell.

An intermediate potential Vpass (about 8V) has been supplied to wordlines of non-selected memory cells to raise channel potential for astate in which the non-selected cells cannot be programmed. Thepotential Vpass has been supplied to non-selected word lines of the RANDcell unit in which several word lines have been selected.

In FIG. 9A, retrieval for programming verification VERIFY 10 is executedafter application of the programming pulses (step S14), the timing beingshown in FIG. 13. The retrieval VERIFY 10 is executed at a potentialVv10 (FIG. 43B) for selected word lines. A “pass” voltage Vread issupplied to non-selected word lines in the same NAND cell unit to allownon-selected cells to be “pass” transistors for judgment only as towhether the memory cells connected to selected word lines have beenturned on or off.

During a bit line pre-charging period from a moment R4 to R7 (FIG. 13),in FIG. 2, the NMOS transistors 47 and 41, and the bit selectiontransistor 60 are turned on to pre-charge the bit line BLe. In detail, avoltage Vpre is supplied to the gate of the NMOS transistor 41 while avoltage (Vpre−Vt), lower than Vdd, is pre-charged to the bit line BLe(Vt; a threshold voltage).

At the moment R7 (FIG. 13), a source-side selection transistor SG2 (FIG.3) of a NAND cell unit NU is turned on to start discharging from the bitline BLe in accordance with a state or threshold level Vt of selectedcells.

In detail, selected memory cells are turned on, when the threshold levelVt is lower than Vv10, to discharge the pre-charged potential (Vpre−Vt)from the bit line Ble.

On the other hand, the selected memory cells are not turned on, when thethreshold level Vt is higher than Vv10, to clamp the pre-chargedpotential (Vpre−Vt) on the bit line BLe.

Data to be programmed is then stored at the node N3 before amplifyingand sensing the potential on the bit line BLe. In detail, a voltage(Vdd+α) is charged at the node S3 to a floating state by a moment S1,and then a potential DTG at the gate of the NMOS transistor 45 is set atVdd at a moment S2. A capacitor 49 (FIG. 2) is connected to the node N3for suppressing noises generated due to decrease in potential caused bycurrent leak or coupling between wiring while the node N3 is beingbrought into a floating state.

In FIG. 2, the level “HIGH”, at the node N1 that has stored data to beprogrammed, turns off the NMOS transistor 45, so that the node N3 hasbeen set at the level “HIGH” whereas the level “LOW” at the node N1turns on the NMOS transistor 45, so that the node N3 is set at the level“LOW”.

Then, the first latch 1 a is dis-activated for amplifying and sensingthe potential on the bit line BLe. In detail, potentials LAT and SEN atthe gates of NMOS transistors 14 and 18, respectively, are set at “LOW”while potentials LATB and SENB (the reverse potential of LAT and SEN,respectively) at the gates of NMOS transistors 13 and 17, respectively,are set at “HIGH”.

After the first latch 1 a has been dis-activated, the potential BLCD isset at the level “HIGH” to turn on the switching device 42 to bring thenodes N1 and N4 at the same potential, thus the NMOS transistor 47 beingturned on to set these nodes at the level “HIGH”.

At the moment S7, a potential BLCLAMP at the gate of the NMOS transistor41 is set at a sensing potential Vsen. The NMOS transistor 41 turns onwhen the potential on the bit line BLe has been discharged from(Vpre−Vt) to (Vsen−Vt), so that the potentials at the nodes N1 and NEare lowered from Vdd to the level almost equal to the potential on thebit line BLe. Electric charges stored at the node N1 and N4 areinstantaneously discharged due to the fact that the bit line capacity isextremely larger than the node capacity.

On the other hand, the NMOS transistor 41 does not turn on when thepotential on the bit line BLe has not been discharged to (Vsen−Vt), sothat the potentials at the nodes N1 and N4 are clamped at Vdd.

When the potential at the node N1 is lowered, it is lowered to thepotential on the bit line BLe, not any further. Clamping the potentialat the node N1 at Vdd is like amplification of the potential on the bitline BLe because Vdd is higher than the potential (Vpre−Vt) pre-chargedon the bit line BLe. In FIG. 13, the solid line for BL (the potential onthe bit line BLe) represents discharging which indicates the memory cellis not programmed enough or not programmed.

At a moment S9, the control signal REG is set at the level “HIGH” toturn on the switching transistor 43.

A level “LOW” at the node N3, or a “0”-programmed state in programmingpulse applying operation, does not allow the NMOS transistor 44 to turnon, which causes no change in potential at the nodes N1 and N4, so thatthe potential on the bit line BLe has appeared at the node N1 until amoment S11.

The potential SEN at the gate of the NMOS transistor 18 and thepotential SENB at the gate of the NMOS transistor 17 are set at thelevels “HIGH” and “LOW”, respectively, at the moment S11 to activate theclocked inverters in the first latch 1 a for sensing the potential atthe node N1 (functioning as the gate of the latch 1 a).

At a moment S2, the potential LAT at the gate of the NMOS transistor 14and the potential LATB at the gate of the NMOS transistor 13 are set atthe levels “HIGH” and “LOW”, respectively, to activate the first latch 1a for retrieving the potential at the node N1 as two-level data “LOW” or“HGIH”. The data “LOW” at the node N1 is transferred again to a selectedbit line in the succeeding programming pulse applying operation, thusthe selected cell being programmed in a “0”-state.

When the pre-charged potential on the bit line Ble is clamped asindicated by a dashed line for BL in FIG. 13 with no flow, of a cellcurrent, data “HIGH” is stored in the first latch la after sensing forcompletion of programming to the selected memory cell.

The data “HIGH” stored in the first latch 1 a after retrieval forprogramming verification allows the level “HIGH” to be transferred tothe selected bit line Be, thus the cell being programmed with “1” forprogramming prohibition.

On the other hand, a level “HIGH” at the node N3, or data “1” beingprogrammed in programming pulse applying operation, allows the commonsignal line COM to transfer the level “HIGH” to the nodes N1 and N4. Thelevel “HIGH” is stored again at the node N1 at the moment 512, thus thelevel “HIGH” being stored at the node N1 in “1”-programming statewithout respect to the result of programming verification, to keep“1”-programmed state for programming prohibition.

FIGS. 32 and 33 indicate the potential change at the nodes and on thebit and word lines for the operations disclosed so far.

The node N1 (FIG. 2) is changed into the “1”-programming state at thelevel “HIGH” in page buffers for which programming is completed.Detection of the state at the node N1 or the node N2 (the reversedstate) for all page buffers in one page allows the judgement as towhether one-page programming has been completed or not (step S15 in FIG.9A). The process returns to steps S13 and S14 when the node N1 has beenat the level “LOW” for at least any of the page buffers, to performprogramming pulse applying operation and retrieval for programmingverification.

As disclosed above, in the NAND-type flash EEPROM, page buffersconnected to memory cells, for which programming has been completedaccording to retrieval for programming verification, are changed to the“1”-programmed state, thus threshold level-distribution being narrowlycontrolled even though the programming pulse applying operation iscontinuously performed until all memory cells for one page has beenprogrammed. This programming control for each page buffer in one page iscalled per-bit verification.

The programming pulse applying operation is performed for attaining ahigher programming speed in such a way that a programming voltage Vpgmis raised step by step for each programming pulse applying operation andretrieval for programming verification. This is shown in FIG. 14 inwhich the potential on a selected word line WL varies as indicated bythe solid line.

Disclosed next is programming and retrieval for programming verificationin selection of the first address for multilevel operation.

FIG. 9B is a flow chart of a programming operation for the upper bit (inselection of the first row address for multilevel operation).

Data to be programmed in selection of the first row address formultilevel operation is loaded into the second latch 2 a (FIG. 2)through an external data input/output terminal (step S21). The data inthe latch 2 a is transferred to the first latch 1 a (step S22) inaccordance with the timing shown in FIG. 10A. The steps S21 and S22 areillustrated in FIG. 15A.

Next, as illustrated in FIG. 15B, the lower-bit data (in selection ofthe second row address for multilevel operation) is stored in the secondlatch 2 a (step S23 in FIG. 9B). This operation is called internal dataloading and performed in accordance with the timing shown in FIG. 16.The node N1 (FIG. 2) is changed to the level “LOW” after the data isstored in the latch 2 a, as indicated by the solid line in FIG. 16.

Retrieval is performed after a selected word line is set at Vr10 (FIG.43B) in which the same word line is selected for both the first and thesecond row addresses for multilevel operation.

For a bit line pre-charging period from a moment R4 to R7 (FIG. 16), theNMOS transistors 47 and 41 and also the bit line selection transistor 60are turned on to pre-charge the bit line BLe. In detail, a potential Preis supplied to the gate of the NMOS transistor 41 to pre-charge thepotential (Vpre−Vt) to the bit line BLe.

At the moment R7, the source-side selection transistor SG2 (FIG. 3) in aNAND cell unit NU is turned on to start discharging the bit line BLeaccording to the state of cells. In FIG. 16, the solid line for BLeindicates discharging therefrom in the “11”-stored cells. Only in thisretrieval operation, retrieved data is stored in the second latch 2 a.Before sensing the bit line potential, at the moment S4, signals CLATand CSEN at the gates of NMOS transistors 24 and 28, respectively, havebeen set at the level “LOW” for dis-activating the latch 2 a. SignalsCLATS and CSE are the reversal of the signals CLAT and CSEN,respectively.

At a moment S5, a signal BLCD2 at the gate of the NMOS transistor 30 isset at the level “HIGH” to turn on the transistor 30 while the nodes N4and N5 are pre-charged to Vdd via the NMOS transistor 47.

At the moment S7, the potential BLCLAMP at the gate of the NMOStransistor 41 is set at the sensing potential Vsen so that the bit linepotential appear at the nodes N4 and N5 in accordance with the clampingoperation already disclosed with reference to FIG. 13 (the moment S7).

At a moment S11, the signals CSEN and CSENB at the gates m of NMOStransistors 28 and 27, respectively, are set at the levels “HIGH” and“LOW”, respectively, to activate the clocked inverters in the secondlatch 2 a for which the node N5 functions as the input gate. Thepotential at the node N5 is sensed by the clocked inverters.

At a moment S12, the signals CLAT and CLATB at the gates of NMOStransistors 24 and 23, respectively, are set at the levels “HIGH” and“LOW”, respectively, to activate the second latch 2 a for data retrieval(step S23 in FIG. 9B) The potential BLCD at the gate of the NMOStransistor 42 has been at the level “LOW” during this operation so thatthe transistor 42 has been turned off, thus externally input data to beprogrammed is stored in the first latch 1 a.

As disclosed, data to be programmed for the first row address formultilevel operation is stored in the first larch 1 a and the data to beprogrammed for the second row address for multilevel operation isretrieved from the memory cell and stored in the second latch 2 a, andthen the programming pulse applying operation starts (step S24 in FIG.9B).

The programming pulse applying operation is performed in accordance withthe timing shown in FIG. 11, like the operation described already forthe selection of the second address for multilevel operation, with thetransfer of data to be stored in the first latch 1 a to a selected bitline.

In programming for the selection of the first row address for multileveloperation, the threshold level (Vt) distribution is varied, as shown inFIG. 43B.

In detail, a “11”-programmed cell is programmed with “01” and“10”-programmed cell is programmed is “00 when the level “LOW” has beenclamped at the node N1 connected to the first latch 1 a. On the otherhand, when the level “HIGH” has been clamped at the node N1, whichindicates “1”-programming for programming prohibition, the “11”- and“10”-programmed cells continuously store “11” and “10”, respectively.

There are four states for the memory cells as disclosed above, thecorresponding operations are indicated in FIGS. 34 to 37.

Programming from “11” to “01” and “10” to “00” are simultaneouslyperformed with applying the same programming voltage to selected wordlines. This operation requires VERIFY00 (step S25 in FIG. 9B) forretrieval for “00”-programming verification and also VERIFY01 (step S26in FIG. 9B) for retrieval for “00”-programming verification, after oneprogramming pulse applying operation.

For these operations, programming should not be completed in“00”-programming verification for the memory cells that are beingprogrammed with “01”. This is because the retrieval for “00”-programmingverification (VERIFY00) is performed with supplying Vv00 (FIG. 43B) toselected word lines whereas, for the memory cells that are beingprogrammed with “01”, a threshold level raises at the level of ““00”does not allow discharging the potential on the bit line in VERIFY00,thus it seems that programming is completed for the memory cells thatare still being programmed with “01”.

In order to overcome such a problem, the first embodiment performsretrieval control for programming verification based on datacorresponding to the second row address for multilevel operation storedin the second latch 2 a (FIG. 2).

FIG. 17 shows an example of the timing for VERIFY00 (step S25 in FIG.9B) for retrieval for “00”-programming verification.

In a pre-charging period from a moment R4 to R7, the NMOS transistors 30and 41, and the bit selection transistor 60 are turned on to pre-chargethe bit line BLe from the node 5 of the second latch 2 a.

During the programming of “01” in the “11”-stored cells, the node 5 ofthe second latch 2 a has been set as the level “LOW” after internalloading for loading data corresponding to the second row address formultilevel operation. This is because the internal loading requires thevoltage Vr10 (FIG. 43B) on the selected word lines, so that the“11”-stored memory cells are turned on to discharge pre-charged voltageon the bit line for retrieving “LOW” after sensing.

This results in “LOW”-pre-charging in the page buffers for which“01”-programming has been proceeding. Pre-charging which will be failedis initially performed for the memory cells to be programmed with “01”because these cells require failure for retrieval for programmingverification in VERIFY00 (FIG. 9B).

On the other hand, in page buffers for which “00”-programming is to beperformed to the “10”-stored memory cells, the node N5 of the secondlatch 2 a has been set at the level “HIGH”, thus performing bit linepre-charging like other retrieval. The latch 2 a is included in eachpage buffer in a page as a unit of programming. Thus, regularpre-charging is performed to selected bit lines for page buffers thathave conducting “00”-programming whereas pre-charging which will befailed is performed for page buffers that have conducting“01”-programming (selective pre-charging).

Setting 0V on the bit line before VERIFY00 (FIG. 9B) serves to consume asmall current because no necessarily pre-charging current will not flowfor a period of the selective pre-charging described above from thesecond latch 2 a after starting VERIFY00.

In FIG. 17, for the node n5 and the bit line BLe (indicated as BL in thefigure), a wave form indicated by the solid line represents“00”-programming while the dashed line (at the GND level) represents“01”-programming.

After the moment R7 (FIG. 17), the process the same as the retrieval forprogramming verification described above is performed. In the pagebuffers for performing “00”-programming, the bit lane BLe is pre-chargedfor the period up to the moment R7 as indicated by the solid line forBL. Depending on the selected cells that have been turned on or off, thebit line BLe is discharged or not. Then, after the moment R7, thesensing potential Vsen supplied at the gate of the NMOS transistor 41(FIG. 2) amplifies and senses the potential on the bit line BLe, thusthe result of programming is stored in the first latch la.

In “1”-programming for clamping “10”-state in which the level “HIGH” hasbeen stored in the second latch 2 a, the level “HIGH” has been clampedat the node N1, thus the node N1 is charged to the level “HIGH” at amoment R9 by the per-bit verification described above with the dataclamped at the node N3 for clamping the “1”-programmed state.

Disclosed next is retrieval VERIFY01 (step S26 in FIG. 9B) for“01”-programming verification with reference to FIG. 18 that shows anexample of the timing for VERIFY01.

The difference between VERIFY00 and VERIFY01 is that, in the latter, aselected word line is set at Vv01 (FIG. 43B) for retrieval forprogramming verification.

For page buffers performing “01”-programming from “11”, a bit linepotential is sensed at the selected word line potential Vv01, while for“1”-programming for clamping the “11”-state, the node N1 is re-chargedto clamp the “1”-programmed state.

On the other hand, for page buffers performing “00”-programming from“10”, programming will alway be failed for the memory cells for whichprogramming has been failed in VERIFY00. This is because a thresholdlevel Vt for the memory cells for which programming will be failed inVERIFY00 is lower than Vv00, which results in that failure will oftenoccur for retrieval at Vv01 on the selected word line in VERIFY01.

For page buffers for programming “1” for clamping the “00”-programmedstate, the per-bit verification described above is performed forclamping the “1”-programmed state without failure.

As disclosed above, retrieval for programming verification in VERIFY00and VERIFY01 is realized. A programming cycle having the programmingpulse applying operation and the retrieval for programming verificationis repeated until programming is completed for all page buffers in apage (step S27 in FIG. 9B) to execute programming in selection of thefirst row address for multilevel operation.

Disclosed next with reference to FIGS. 19A and 19B is a retrievaloperation.

Retrieval depends on row addresses because, as illustrated in FIG. 43B,2-bit data in multilevel operation is allocated in such a way that theupper and the lower bits are used as data in selection of the first andthe second row addresses, respectively, in multilevel operation.

In retrieval of the upper bit at which the first row address formultilevel operation has been stored, a retrieval operation READ00 (stepS41 shown in FIG. 19B) is performed only once at the potential Vr00(FIG. 43B) on the selected word line, to retrieve 2-bit data of “0” or“1”.

On the other hand, in retrieval of the lower bit at which the second rowaddress for multilevel operation has been stored, two retrievaloperations READ00 and also READ 10 (steps S31 and S32 shown in FIG. 19A)are performed at the potentials Vr01 and Vr10 (FIG. 43B), respectively,on the selected word line.

Disclosed first is the retrieval operation READ00 in selection of thefirst row address for multilevel operation with respect to an example ofthe timing of READ00 in FIG. 20.

For a pre-charging period up to a moment R7, in FIG. 2, the NMOStransistors 47 and 41, and the bit line selection transistor 60 areturned on. The potential Pre is supplied to the gate of the NMOStransistor 41 to pre-charge (Vpre−Vt) on the bit line BLe. Thesource-side transistor SG2 (FIG. 3) in a NAND cell unit NU is turned onat the moment R7 to start discharging from the selected bit line.

At a moment S4, the potentials LAT and SEN at the gates of the NMOStransistors 14 and 18, respectively, are set at the level “LOW” to turnon the NMOS transistor 42 for setting the nodes N1 and N4 at the samepotential and also turn on the NMOS transistor 47 to be charged at Vdd.

At the moment S7, the potential CLAMP at the gate of the NMOS transistor41 is set at Vsen to clamp the bit line potential for retrieval, thus asmall bit line potential (Vpre−Vse) of about 0.4V being amplified andretrieved at the node R1.

At moments S11 and Sl2, the potentials LAT and SEN are set at the level“HIGH,” in this order to successively activate the clocked inverters ofthe first latch 1 a to retrieve the data at the node N1.

After the data has been stored in the latch 1 a, data for one page thathave already been stored in the latch 1 a are simultaneously transferredto the second latch 2 a (step S42 in FIG. 19B). For pages each having512 bytes, data are simultaneously transferred from the latch 1 a to thesecond latch 2 a in each 512-byte page buffer in accordance with thetiming shown in FIG. 10B.

Each second latch 2 a is connected to the data input/output buffer 50 avia the column selection transistors 51 and 52 through the data linesio/ion, as shown in FIG. 3. A “HIGH” level-column decode signal CSLallows data to be retrieved out from the latch 2 a via the datainput/output buffer 50 a through the data lines io/ion.

In the cell array divided into two trays as shown in FIG. 45B,simultaneous retrieval described above in selection of one page of thetwo arrays with one row address allows simultaneous data transfer in2-page page buffer under the control of the data input/output buffer 50a such that 1-page data of the cell 100 a is output by the second latch2 a after data transfer, and then 1-page data of the cell 100 b isoutput.

As disclosed, data in selection of the first row address for multileveloperation can be output with one retrieval and data transfer operation.

Disclosed next is a retrieval operation in selection of the second rowaddress for multilevel operation.

This retrieval operation is performed twice as READ01 and READ10 insteps S31 and 32, as shown in FIG. 19A.

FIG. 21 is an example of the timing for READ01. The difference betweenREAD00 (FIG. 19B) and READ01 is only that the latter has a selected wordline potential Vr01 (FIG. 43B), thus the detailed description of READ01being omitted.

After READ01, a retrieved data is stored in the first latch 1 a (FIG.2), followed by READ10, an example of the timing for READ10 being shownin FIG. 22 Retrieval is performed at the selected word line potentialVr10 (FIG. 43B). The retrieval operation in READ10 is almost the same asREAD01 from bit line pre-charging to the moment S9, the differencesbetween READ10 and READ00 (and READ01) being that, in the former, apotential COMRST at the gate of an NMOS transistor 91 and a potential ata node COM (the common signal line COM) are set at the levels “HIGH” and“LOW”, respectively.

In READ10 following READ01, the data retrieved in READ01 has been storedin the first latch 1 a until the moment S4.

The potential at the node N3 is not related to the retrieval operationin READ00 and READ01, however, related in READ10. In detail, the node N3is charged to (Vdd+α) to be floating by a moment S2. A Vdd-level DTG atthe gate of the NMOS transistor 45 at the moment S2 allows the node N3to clamp (Vdd+α) when the node N1 connected to the first latch 1 a isclamped at the level “HIGH” whereas the node N3 is discharged to 0V whenthe node N1 is at the level “LOW”.

At a moment 57, the bit line potential is amplified and then, at amoment S9, the control signal REG is set at the level “HIGH” to turn onthe NMOS transistor 44 because the node N3 has been at the level “HIGH”when the node N1 has been clasped at the level “HIGH” in READ01 (FIG.19A). This results in discharging from the nodes N1 and N4 to the nodeCOM, and then, at a moment S12, the node N1 is clamped at the level“LOW”. In other words, the level “LOW” as data “1” is stored at the nodeN1 when the memory cell is in the “01”-state shown in FIG. 43B.

When the level “LOW” is stored at the node N1 in READ01, the NMOStransistor 44 is not turned on at the moment S9, thus no dischargingfrom the nodes N1 and N4, and the potential at the node N1 that is theamplified bit line potential being sensed and stored at moments S11 andS12.

On completion of READ00 and READ10, the data retrieved for the secondrow address for multilevel operation and stored in the first latch 1 ais transferred to the second latch 2 a (step S33 in FIG. 19A) inaccordance with the timing shown in FIG. 10B, the process (FIG. 19A)being completed in which the latch 2 a being ready for data output.

The potential change in the retrieval operation disclosed above is shownin FIGS. 38 to 41. FIG. 38 shows the first (upper) bit retrieval whileFIGS. 39 to 41 show the second (lower) bit retrieval. Particularly,FIGS. 40 and 41 shown the second time-lower bit retrieval when thepotential at the node N1 has been “HIGH” and “LOW”, respectively, as theresult of the first time-lower bit retrieval.

Disclosed next is usage of the second latch 2 a (FIG. 2) as a cachememory for enhancing effective programming speed.

The relationship between data and distribution of threshold level Vt for1-bit memory cell in two-level operation mode is illustrated in FIG. 23.

Retrieval with the second latch 2 a as a cache memory is performed likeREAD00 (FIG. FIG. 19B) already descried except that a selected word lineis set at Vr0 in FIG. 23 because this retrieval operation is performedonly once.

FIGS. 24A and 24B illustrate examples of timing for retrieval with thesecond latch 2 a as a cache memory.

In detail, FIG. 24A illustrates retrieval using one memory cell array.On reception of a retrieval command “00H” and entry of the first rowaddress, READY//BUSY (abbreviated to R/BB hereinafter) is set at thelevel “LOW”, or a busy-state is output to perform PAGE RETRIEVAL 1 (thesame as READ00 in FIG. 19B).

On completion of PACE RETRIEVAL 1, 512-byte data that correspond to theretrieved first row address and have been stored in the first latch 1 a(FIG. 2) of each page buffer are transferred to the second latch 2 a thesame as in step 533 in FIG. 19A.

Then, R/BB is set at the level “HIGH” (a ready state) to allow SERIALDATA OUTPUT 1 with a retrieval enable signal READ-ENABLE. In detail, thedata corresponding to the first row address is output from the secondlatch 2 a to the data input/output terminal I/O (FIG. 3) in synchronismwith the signal READ-ENABL while the second row address is beingselected for execution of PAGE RETRIEVAL 2 with R/BB set at the level“LOW” (a bust state BUSY).

Completion of SERIAL DATA OUTPUT 1 is detected to set R/BB at the level“LOW” (BUSY) for performing data transfer from the first latch 1 a tothe second latch 2 a. In other words, The data stored in the latch 1 a(the result of PAGE RETRIEVAL 2) cannot he transferred to the latch 2 auntil SERIAL DATA OUTPUT 1 from the latch 2 a is completed.

On completion of the data transfer, R/BB is set again at the level“HIGH” (a ready state) to start SERIAL DATA OUTPUT 2 while the third rowaddress is being selected to execute PAGE RETRIEVAL 3.

The retrieval operation as disclosed above serves to shorten a period“tdb” between SERIAL DATA OUTPUTS 1 and 2 for the second row addressretrieval during data output corresponding to the first row address.

When one page capacity is 512 bytes, a page-retrieval time is 10 μs anda serial data output cycle is 50 ns, an effective retrieval time isgenerally 14 Mbytes/s, however, in this embodiment, the maximumeffective retrieval time reaches 19 Mbytes/s at tdb=1 μs.

Here, R/BB is a READY//BUSY signal for a user to determine whether datainput/output is enable or not whereas INTERNAL R/BB shown in FIG. 24A isa flag signal for the controller 110 (FIG. 1) to judge the controlsequence, the same as in the following disclosure.

FIG. 24B illustrates simultaneous retrieval from a 2-array memory cell.

After entry of retrieval command “00HI” and address, PAGE RETRIEVAL 1 isperformed for the input first row address to the cell array 100 a (FIG.45B) and also PAGE RETRIEVAL 2 for the same input first row address tothe cell array 100 b (FIG. 45B). In other words, two pages are selectedfor the first row address, which seems to be double page capacity whenlooked from outside the EEPROM chip.

Like shorn in FIG. 24A, R/BB has been set at the level “LOW” (BUSY)until each retrieval and data transfer is completed.

For data output, DATA OUPUT 1 from the cell array 100 a and DATA OUPUT 2from the cell array 100 b are performed in this order.

On data output, the second row address is selected to execute PAGERETRIEVALs 3 and 4 from the cell arrays 100 a and 100 b, respectively.

The maximum effective retrieval speed reaches 20 Mbytes at tdb=1 μs inthis retrieval operation whereas 17 bytes in general.

Disclosed next with reference to FIGS. 25A to 25C are programmingoperations with the second latch 2 a as a cache memory for simultaneousprogramming to the cell arrays 100 a and 100 b.

After entry of data input command 80H and address, data to be programmed“Data 1” corresponding to the first row address is input (Load 1) to thecell array 100 a. And then, after entry of data input command 80H andaddress, data to be programmed “Data 2” corresponding to the second rowaddress is input (Load 2) to the cell array 100 b.

A programming command “10Hd” is a dummy command under which noprogramming operation is performed for simultaneous programming to twocell arrays.

For enabling sequential data loading “load 3” and “Load 4”, R/BB is setat the level “LOW” (a busy signal) and instantaneously set at the level“HIGH” (a quasi-ready signal).

After entry of the initial data input command “80H”, the second latches2 a used as a cache memory in all page buffers are reset (C, Rst inFIGS. 25A to 25C) by switching the PMOS transistor 82 (FIG. 2).

A programming execution command “10Hc” (FIG. 25A) following “Load 2”starts simultaneous programming to two cell arrays. Data is transferredfrom the second latch 2 a to the first latch 1 a in each page buffer,followed by the programming pulse applying operation and the retrievalfor programming verification as already described.

The data transfer is executed in accordance with the timing shown inFIG. 10A. The programming pulse applying operation is executed inaccordance with the timing shown in FIG. 11. Moreover, the retrieval forprogramming verification is executed in accordance with the timing likeVERIFY 1 shown in FIG. 13 at the selected word line voltage Vv0.

The internal R/BB is set at the level “LOW” (a busy state) while theprogramming is being executed. After data transfer, R/BB is set at thelevel “HIGH” (a quasi-ready state) to allow data loading to the secondlatch 2 a because all latches 2 a are free from the programming pulseapplying operation after data loading as already discussed.

After data loading “Load 4”, the programming execution command “10Hc” isentered again. When simultaneous programming of data “Data 1” and “data2” has not been completed, data “Data 3” and “Data 4” stored in thesecond latch 2 a cannot be transferred to the first latch 1 a. Such datatransfer is performed after the programming of the data “Data 1” and“Data 2” is completed and the internal R/BB is set at the level “HIGH”(a ready state). Then, programming of the data “Data 3” and “Data 4” isexecuted and R/BB is set at the level “HIGH” (a ready state), to enablethe succeeding data loading to the latch 2 a.

Like the retrieval operation, also in this programming operation,selection can be perform one page by one page on two or more arrays toone row address, as illustrated in FIG. 25B using the second latch 2 aas a cache memory.

Following the data loading “Load 1” for the cell array 100 a (FIG. 45B),the data loading “Load 2” for the cell array 100 b is executed with theprogramming execution command “10Hc” under which programming of the data“Data 1” and “Data 2” starts while enabling the succeeding data loading.

FIG. 25C illustrates the timing of the programming operation using thesecond latch 2 a as a cache memory for 1-array cell memory, Theprogramming execution command “10Hc” enables both data programmingoperation and data loading.

The same for the timing shown in FIGS. 25A to 25C is that the transferof data loaded into the cache memory (the second latch 2 a) to the firstlatch 1 a is allowed after that the internal R/BB is set in a readystate.

The following are effective programming speeds achieved in thisembodiment using the second latch 2 a as a cache memory under therequirement that a serial data input cycle and a 1-pageprogramming-completion time are 50 ns and 200 μs, respectively, at 512bytes per page.

In 2-array memory cell simultaneous programming, compared to 4.1 Mbyteswith no cache memory, the embodiment using a cache memory achieves5.1-Mbyte effective programming speed because a 2-page data loading timeis masked behind the programming time.

Moreover, in 4-array memory cell simultaneous programming, compared to6.8 Mbytes with no cache memory, the embodiment using a cache memoryachieves 10-Mbytes.

Accordingly, the present invention achieves a vary high effectiveprogramming speed by using a cache memory for both 2- and 4-array memorycell simultaneous programming.

As disclosed, the page buffer 140 shown in FIG. 2 offers a multileveloperation, moreover, in two-level operation, offers a caching functionfor higher effective programming and retrieval speed.

Moreover, the page buffer 140 functions like the one for two-leveloperation when the second latch 2 a and the NUS transistor 30 areomitted. A PMOS transistor 90 and the NMOS transistor 91, both connectedto the node COM, can be shared by a plurality of page buffers, forexample, one for each per 8 page buffers the same number of I/Os.

Therefore, the page buffer 140 offers both the multilevel operation(function) and caching function in a simple way as disclosed above Bothfunctions are switched with changing programming and retrieval controlperformed by the controller 110 (FIG. 1). Thus, the present inventionachieves switching the multilevel operation and the caching function intwo-level function by changing control and address space under commandentry.

(Second Preferred Embodiment)

The first embodiment with 2-array memory cell in caching operation hasseveral advantages as discussed above.

The second latch 2 a (FIG. 2) functioning as a cache memory is reset atentry of address before 2-page data loading, for example, at entry ofaddress before “Load 1” and “Load 3” in FIG. 25A. The larch 2 a must bereset before data loading, however, the resetting after execution ofdata load command during programming after data transfer could beperformed at any timing during programming due to unstable data loadcommand timing. This further could cause affection of noise from powersupply to the resetting operation to the second latch 2 a while sensingthe retrieval for programming verification.

To overcome such a problem, the second embodiment performs resetting ofthe second latch 2 a just after data transfer from the latch 2 a to thefirst latch 1 a, as shown in FIG. 26, or performs the resetting alwaysbefore programming operation.

The resetting of the second latch 2 a is required before the initialdata loading. However, resetting at unstable timing to the latch 2 aduring programming can be eliminated with no resetting at entry of “80H”and address daring programming.

FIG. 27 illustrates a programming operation using a cache memory foreliminating such resetting at unstable timing, which is applicable tothe operations FIGS. 25A to 25C.

In detail, 2-page simultaneous programming starts after 2-page dataloading “Load 1” and “Load 2”, and then, on completion of data transferfrom the second latch 2 a to the first latch la and latch (2a)-resetting (C, Rst), R/BB is set a quasi-ready state “HIGH”.

This sequence allows resetting the latch 2 a only before programming nomatter how varies the timing t1 for succeeding data load command entryduring programming of the data “Data 1” and “Data 2” or the followingtiming t2, thus suppressing noise from power sully in programming usinga cache memory.

(Third Preferred Embodiment)

Disclosed in the first embodiment is switching between the multileveloperation for storing 2-bit data to one non-volatile memory cell and thecaching operation in two-level operation using the page buffer 140 (FIG.2).

A caching operation rising the second latch 2 a is also possible inmultilevel operation while the latch 2 a is free, for example, during aretrieval operation. As shown in FIG. 28A, data output from the latch 2a is allowed while the main page buffer having the first latch 1 a isbeing connected to a selected bit line for retrieval.

The second latch 2 a is also free from programming in selection of thesecond row address for multilevel operation. The succeeding data to beprogrammed thus can be loaded into the latch 2 a during programming, asshown in FIG. 28B.

The caching function is, however, prohibited in programming in selectionof the first row address for multilevel operation because theprogramming is executed while the data in selection of the second rowaddress for multilevel operation has been stored in the second latch 2 aby the internal data loading already described.

FIG. 29 illustrates a program operation in a multilevel operation modeusing a cache memory. In the drawing, “Lower Data” and “Upper Dataa”represents data to be programmed for the second row address and thefirst row address, respectively, for multilevel operation.

In FIG. 29, “Lower Data 1” and “Lower Data 2” for the second address formultilevel operation are successively input at data loading “Load 1” and“Load 2”, respectively. On entry of the first programming executioncommand “10Hc”, data is transferred from the second latch 2 a to thefirs latch 1 a simultaneously for two memory cell arrays and programmingis executed for the second row address for multilevel operation duringthe succeeding data loading “Load 3” and “Load 4” for entry of data“Upper Data 1”, and “Upper Data 2” to be programmed, respectively, forthe first row address for multilevel operation.

On completion of the programming for the second row address formultilevel operation, the data to be programmed for the first rowaddress for multilevel operation is transferred from the second latch 2a to the first latch 1 a to start programming.

Although not indicated in FIG. 29 for the programming for the first rowaddress for multilevel operation, the data corresponding to the secondrow address for multilevel operation has been retrieved from a selectedmemory cell and stored in the second latch 2 a by the internal dataloading already described.

This prohibits the succeeding data loading until completion of upper-bitprogramming in selection of the first row address for multileveloperation. Although, whether the sequential programming is allowed ornot depends on row address for programming, a data loading time can beshortened by half with the caching operation.

The third embodiment thus also achieves high effective programming speedalthough programming in the multilevel made takes long compared to usualtwo-level mode for storing 1-bit data to one nonvolatile memory cell.

(Fourth Preferred Embodiment)

Elements in this embodiment that are the same as or analogous toelements in the first embodiment are referenced by the same referencenumbers and will not be explained in detail.

In a page buffer 140 a shown in FIG. 30, the switching NMOS transistor31 is provided between the nodes N1 and N5 for the first latch 1 a andthe second latch 2 a, respectively.

This circuit arrangement achieves the caching function discussed abovealthough without multilevel function. Data transfer between the latchesla and 2 a is allowed under control of the NMCS transistor 31 fortransferring the level “HIGH” or “LOW”.

(Fifth Preferred Embodiment)

NAND-type flash EEPROMs repeat the programming pulse applying operationand the retrieval operation for programming verification untilprogramming of all 512-byte memory cells in one page is completed.

FIG. 14 illustrates a voltage waveform applied to a selected word linein step-up pulse-programming in which a programming voltage Vpgm isincreased step by step during the repetition of programming pulseapplying and retrieval for programming verification cycle.

The step-up pulse-programming is automatically executed by a controller,however, the control can be interrupted for measurement of cell currentwith the page buffer 140 shown in FIG. 2.

As disclosed, a two-level programming verification operation iscontrolled by the main reprogramming retrieval circuit 10 and theretrieved data after verification is stored in the first latch la.Therefore, on completion of one cycle of programming pulse applyingoperation and retrieval operation for programming verification, a usualprogramming control for executing the succeeding programming pulseapplying operation is prohibited in accordance with the result ofverification, for measurement of cell current, with securing the datastored in the latch 1 a under programming.

The cell current measurement is performed in a way that, in FIG. 2, thepotential BLCD is set at the level “LOW” to turn off the switching NMOS42 to clamp data in the first latch 1 a while the potentials CLAT andCSEN are set at the level LOW, and the potentials CLATB and CSENB areset at the level “HIGH” simultaneously, to dis-activate the second latch2 a to turn on the bit line selection transistor 60, the transfertransistors 41 and 30, and also the column gate transistor 51 locatedbetween a selected bit line and the data line “io”, to turn on from theline “io” to the data input/output terminals I/O.

Measurement of cell current is illustrated in FIGS. 31A and 31B. FIG.31A teaches a known test mode with a mode for programming voltagesetting or programming or cell current measurement mode whereas FIG. 31Bthe test mode according to the present invention.

The known mode requires complex control in which a verify result isretrieved from a latch, and, after completion of cell current sensing,the verify result is retrieved again for the succeeding programming, forjudgement of cell current/verify result relationship, otherwise, thecell current measurement mode will damage the verify result stored in alatch.

Moreover, as indicated in FIG. 31A, the rising characteristics of avoltage booster affects that of a selected word line voltage and alsoits waveform.

Contrary to this, in the present invention shown in FIG. 31B, aprogramming cycle is interrupted once for cell current measurement whilea verify result in programming is being stored. On completion of thecell current measurement, the succeeding programming cycle starts.

(Sixth Preferred Embodiment)

Elements in this embodiment that are the same as or analogous toelements in the first embodiment are referenced by the same referencenumbers and will not be explained in detail.

FIG. 46 is a circuit diagram of a page buffer 140 b for multileveloperation and caching function.

Different from the page buffer 140 shown in FIG. 2, the page buffer 140b performs data transfer between the first and the second latch 1 a and2 a with switching of NMOS transistors 203 and 204 series-connectedbetween the nodes N2 and N6 of the latches 1 a and 2 a, respectively.

The page buffer 140 b has a clamp NMOS transistor 41 b provided betweena selected bit line and a sense node N4 b, The node N4 b is connected tothe gate of an NMOS transistor 201 for sensing, not directly connectedto the node N1 (FIG. 2). The source of the NMOS transistor 201 isgrounded and its drain is connected to the nodes N1 and N2 via the NMOStransistors 202 and 203, respectively.

The data retrieved at the sense node N4 b via the clamp NMOS transistor41 b turns on or off the NMOS transistor 201. The switched state of theNMOS transistor 201 is transferred to the node N1 or N2 via the NMOStransistor 202 or 203, respectively, selectively activated by a signalBLSEN0 or BLSEN1, which allows the sensed data to be stored in the firstlatch 1 a.

Data transfer between the latches 1 a and 2 a are performed between thenodes N2 and NS via the NMOS transistors 203 and 204 activated bysignals BLSEN1 and BLSSEN1, respectively.

The page buffer 2140 b is also provided with an NMOS transistor 42 b fortransferring a potential at the node N1 to a selected word line.

The node N5 of the second latch 2 a is connected to the sense node N4 bvia an NMOS transistor 30 b that will be turned on for pre-charging aselected bit line in accordance with data stored in the latch 2 a in amultilevel mode.

Also connected to the sense node N4 b is a capacitor 48 having a controlterminal CAPG, for controlling the potential at the node N4 b withcapacitance-coupling.

Disclosed next is a multilevel operation using the page buffer 140 bunder the relationship between data and threshold level in memory cellfor multilevel operation, as shown in FIG. 43B.

The programming of the first (upper) and the second (lower) bits areperformed in accordance with the flow chart shown in FIGS. 9A and 9B.

On the other hand, a retrieval operation for the second bit shown inFIG. 47A is different from FIG. 19A. In detail, the difference is that“Read 10” for applying Vr10 to a selected bit line is executed (stepS31′) before “Read 01” for applying Vr01 to a selected bit line isexecuted (step S32′).

The programming operation and the retrieval operation for programmingverification are disclosed with reference to FIGS. 9A and 9B.

For the lower (second) bit, data to be programmed is loaded into thesecond latch 2 a from the data input/output terminal I/O through thedata signal lines “io” and “ion” (step S11) a The data is thentransferred from the second latch 2 a to the first latch la (step S12),like the foregoing embodiment.

The control signals SEN and LAT (FIG. 46) of the first latch 1 a are setat the level “HIGH” while the signals SENB and LATB at the level “LOW” rto dis-activate the clocked converters CI1 and CI2.

The control signals BLSEN1 and BLSEN2 are set at the level “HIGH” toturn on the NMOS transistors 203 and 204. The potential at the node N6of the second latch 2 a is transferred to the node N2 of the first latch1 a via the NMOS transistors 203 and 204. The clocked converters CT1 andCI2 are activated in this order to store the transferred data.

Likewise, data transfer from the first latch 1 a to the second latch 2 ais performed after the latch 2 a is dis-activated.

After the data transfer, the programming pulse applying operation isperformed (step S13 in FIG. 9A) in which the NMOS transistor 42 b (FIG.46) is turned on to transfer the data at the node N1 of the first latch1 a to a selected bit line. The control signal BLCD to be applied to thegate of the NMOS transistor 42 b is preferably set at a potentialboosted from Vdd for transferring the level “LOW” (0V) or “HIGH” (Vdd)at the node N1 with no decrease in level.

After programming, a voltage Vv10 (FIG. 43B) is supplied to the selectedbit line to perform Verify 10 (step S14) retrieval for programmingverification. FIG. 48 shows potential change when the data “LOW” hasbeen clamped at the node N1 of the first latch 1 a.

The NMOS transistor 47 b for pre-charging is turned on and then theclamp NMOS transistor 41 b is turned on to pre-charge the selected bitline for retrieval for programming verification.

Bit line-data sensing is performed with the NMOS transistor 41 b likethe foregoing embodiment.

The resetting operation shown in FIG. 48 is required for usual retrievaloperation, to reset the latch before loading a sensed data to the latchwhereas it is not required for retrieval for programming verification.

An amplified and retrieved data potential appeared at the node N4 b isstored in the first latch 1 a as a two-level data via the NMOStransistor 203 that is turned on by the control signal BLSEN1 set at thelevel “HIGH”. In detail, a potential at the node N4 b close to Vdd turnson the sensing NMOS transistor 201, thus the potential at the node N2 islowered to the level “LOW” via the NMOS transistors 203 and 201.

On the other hand, a low potential at the node N4 b does not turn on theNMOS transistor 201 (which may exhibit high turn-on resistance), thusthe potential at the node N2 being clamped in the first latch 1 a.

The foregoing operations are performed while the first latch 1 a isactive. To ensure such operations, transistor sizes are determined sothat turn-on resistance for the NMOS transistors 201 to 204 areconsiderably lower than that for the PMOS transistors 11, 13, 15 and 17of the first latch 1 a.

A retrieval operation is performed to a selected cell, and thenprogramming pulses are applied to raise the threshold level on thememory cell, thus a bit line being not discharged and clamped at thelevel “HIGH”. This allows loading the level “LOW” at the node N2 of thefirst latch 1 a, thus the programming being completed.

On the other hand, the bit line is discharged when the threshold levelof the memory cell as low even after the programming pulse application,thus the node N2 of the first latch 1 a is clamped at the level “HIGH”in retrieval for programming verification. The programming pulseapplication and the retrieval for programming verification are repeateduntil the node N2 is set at the level “LOW”.

Contrary to FIG. 48, FIG. 49 shows potential change when the data “HIGH”(“1”-programming, or non-programming) has been clamped at the node N1 ofthe first latch 1 a, which neglects the result of retrieval forprogramming verification because programming pulses do not change thethreshold level of a selected memory cell. The Node N2 of the latch 1 ahas initially been set at the level “LOW” for loading the sensed data ona selected bit line to the latch la Like the foregoing embodiment, theprogramming pulse application and the retrieval for programmingverification are repeated until the nodes N2 and N1 are set at thelevels “LOW” and “HIGH”, respectively, for all page buffers insimultaneous 1-page programming. It is determined wether programming toall cells are completed (step S15 in FIG. 9A), if so, the programmingoperation ends.

Disclosed next is the upper (first) bit programming with reference toFIG. 9B.

In each page buffer, the upper bit data is loaded into the second latch2 a (FIG. 46) through the data signal lines “io” and “ion” (step S21),and then transferred to the first latch 1 a (step S22), followed by theinternal data loading (step 323). As already disclosed, the internaldata loading retrieves the lower-bit data stored in selected memorycells to the latch 2 a.

Like the foregoing embodiments, the first, and the second-bit data to beprogrammed into one memory cell correspond to the first and the secondrow addresses, respectively, for multilevel operation, the two addressesselecting the same word line and memory cell.

FIG. 50 shows potential change in internal data loading.

The second latch 2 a is reset within a period from bit line pre-chargingto bit line potential sensing. In detail, the resetting NMOS transistor84 (FIG. 46) is turned on to rest the nodes N5 and N6 at the levels“LOW” and “HIGH”, respectively. A retrieval voltage Vr10 (FIG. 43B) isthen applied to a selected word line to retrieve a bit line potential tothe node N4 b. The control signal BLSEN2 is set at the level “HIGH” toturn on the NMOS transistor 204, thus a sensed result at the node N4 bbeing stored in the second latch 2 a. Data “11” in a selected cellresults in the level “LOW” at the node N5 whereas “10” results in thelevel “HIGE”.

After the programming pulse applying operation (step S24 in FIG. 9B),retrieval “Verify00” for programming verification to “00” (step S25) isexecuted, followed by retrieval “Verify01” for programming verificationto “01” (step S26).

FIG. 51 shows potential change to “0”-programming to the first bit of“11”-programmed memory cell.

The node N1 of the first latch 1 a has been set at the level “LOW” forstarting “0”-programming. A selected bit line is pre-charged from thenode N5 of the second latch 2 a in the retrieval “Verify00” via the NMOStransistors 30 b and 41 b. A boosted potential enough for transferring a“HIGH”-level Vdd is applied to the gate of the NMOS transistors 30 b toturn on. A potential Vpre for determining a bit line pre-chargepotential for retrieval is applied to the gate of the NMOS transistor 41b to turn on.

The level “LOW” has been clamped at the node N5 when the data “11” isretrieved from a selected cell in the foregoing internal data loading,thus the selected bit line is pre-charged to 0V. The retrieval“Verify00” thus results in the level “LOW” appearing at the node N4 b asa result of hit line potential sensing, with no change in the datastored in the first latch 1 a even though the NMOS transistor is turnedon.

The succeeding retrieval “Veryfy01” is performed with pre-charging theselected bit line via the NMOS transistor 47 b with the potential Vdd atthe node N4 b, like pre-charging for a usual retrieval operation. Theretrieval “Veryfy01” results in a bit line potential appearing at thenode N4 b, which corresponds to the threshold level of a selected cellafter programming pulses have been applied. A result of the retrieval isloaded into the first latch 1 a.

The “01”-programming to the “11”-programmed cell is completed when thenode N1 of the first latch 1 a is set at the level “HIGH” the retrieval“Veryfy01”.

FIG. 52 shows potential change in “0”-programming to the first bit of“10”-programmed memory cell.

The node N1 of the first latch 1 a has been set at the level “LOW” forstarting “0”-programming, A selected bit line is pre-charged from thenode N5 of the second latch 2 a in the retrieval “Verify00” via the NMOStransistors 30 b and 41 b. Like the foregoing disclosure, the potentialVpre is applied to the gate of the transistor 41 b.

Different from the programming to “11”-programmed cell, the level “HIGH”has been clamped at the node N5 in programming to “01”-programmed cell,for bit line pre-charging like the usual retrieval operation. Thebit-line potential is then clamped at the node N4 b in accordance withthe threshold level of a selected cell after the programming pulseapplying operation, the clamped data being loaded into the first latch 1a via the NMOS transistor 203.

The “00”-programming to the “10”-programmed cell is completed when thenode N1 of the first latch 1 a is set at the level “HIGH” in theretrieval “Veryfy00”.

The succeeding retrieval “Verify01” is performed with a high retrievalvoltage Vv01 (FIG. 43B) on the selected word line. The “00”-programmedcell is turned on in the retrieval “Verify01” to set the level “LOW” onthe bit line, thus the sensed data “LOW” appearing at the node N4 b withno change even though the data is stored in the first latch 1 a.

Accordingly, in the retrieval “Verify01”, the level “HIGH” is clamped atthe node N1 for the memory cells to which programming has been completedwhereas the level “LOW” is clamped at the node N1 for the memory cellsunder programming.

FIGS. 53 and 54 show potential change in “1”-programming to the firstbit of “11”- and “10”-programmed cells, respectively.

Like the “0”-programming, the retrieval “Verify00” and “Verify01” aresequentially executed while the levels “HIGH” and “LOW” have beenclamped at the nodes N1 and N2, respectively, of the first latch 1 awith no change even though the NMOS transistor 203 (FIG. 46) is turnedon.

The programming and retrieval for programming verification are repeateduntil the node N1 for all page buffers is set at the level “HIGH” (stepS27 in FIG 9B), and if so, the programming ends.

Disclosed next is a usual multilevel-data retrieval operation using thepage buffer 140 b shown in FIG. 46 with reference to FIG. 55 showingpotential change in first-bit retrieval and FIG. 47B showing a flowchart for first-bit retrieval in selection of the first row address formultilevel operation.

A retrieval voltage Vr00 (FIG. 43B) is applied to a selected word linefor a retrieval operation (step S41). During the period from bit linepre-charging to bit line-potential sensing, the control signal BLSEN0 isset at the level “HIGH” to turn on the NMOS transistor 202, with theNMOS transistor 201 being turned on via the pre-charging transistor 47b, thus the first latch 1 a being reset in which the nodes N1 and N2 areset at the levels “LOW” and “HIGH” respectively.

After the bit line potential is sensed, the node N4 b is set at thelevel “HIGH” or “LOW” which is then loaded into the first latch 1 a viathe NMOS transistor 203 that is turned on by the control signal BELSEN1at the level “HIGH”, The node N4 b is set at the level “LOW” as a resultof bit line-potential sensing when data “11” or “10” has been stored ina selected cell. This results in no discharging from the node N2 via theNMOS transistors 201 and 203, thus the level “LOW” being clamped at thenode N1 of the fist latch 1 a, which is retrieved as data “1”.

On the other hand, the node N4 b is set at the level “HIGH” as a resultof bit line-potential sensing when data “00” or “01” has been stored ina selected cell. This results in discharging from the node N2 via theNMOS transistors 201 and 203, thus the level “HIGH” being clamped at thenode N1, which is retrieved as data “0”.

Data retrieval via the data input/output terminals I/O is performed suchthat the data on the first latch 1 a is transferred to the second latch2 a (step S42) for column address selection via the column-gatetransistors 51 and 52.

FIGS. 56 to 58 show potential change in the second bit retrieval inaccordance with the flow chart in FIG. 47A.

FIG. 56 shows potential change in the first retrieval “Read10” of thetwo retrieval operations “Read10” (step S31′) and “Read01” (step S32′)in FIG. 47A for the second bit retrieval operation in selection of thesecond row address for multilevel operation.

The first retrieval “Read10” applies a retrieval voltage Vr10 shown inFIG. 43B to a selected word line. The retrieval voltage is the onlydifference between the retrieval “Read10” and the retrieval “Read00”shown in FIG. 47B.

The retrieval operation results in the level “LOW” at the first latch 1a from “11”-programmed cells whereas the level “HIGH” from “10”-, “00”-and “10”-programmed cells.

In the succeeding retrieval “Read01”, a retrieval voltage Vr01 shown inFIG. 43B is applied to the selected word line, which causes potentialchange shown in FIGS. 57 and 58. FIG. 57 shows potential change when thenode N1 of the first latch 1 a has been set at the level “LOW” (“11”)inthe first retrieval operation in “Read01”. On the other hand, FIG. 58shows potential change when the node N1 has been set at the level “HIGH”(“10”, “00”, or “10”) in the first retrieval operation in “Read01”.

The second retrieval “Read01” requires no resetting operation before bitline-potential sensing, thus the result of the first retrieval “Read10”has been stored in the first latch 1 a. The result of bit line-sensingclamped at the node N4 b is loaded into the latch 1 a via the NMOStransistor 202 that is turned on by the “HIGH”-level control signalBSSEN0.

When “11”-programmed cells are selected, the level “LOW” has beenclamped at the node N1 of the first latch 1 a (FIG. 57) without respectto the potential at the node N4 b.

When “10”- or “00”-programmed cells are selected, a selected word linepotential is set at Vr01 (FIG. 43B) to turn on the selected cell, thusthe sensed data “LOW” appearing at the node N4 b. This results in ahigh-impedance state for the NMOS a transistor 201 even though it isturned on (or off), thus the potential at the node N1 being unchangedeven the NMOS transistor 202 is turned on to hold the data retrieved inthe former retrieval “Read00” (FIG. 58).

When “01”-programmed cells are selected, they will not be turned on at aselected word line voltage Vr01, with no discharging from the bit line,the level “HIGH” is set at the node N4 b after bit line-potentialsensing. The NMOS transistor 201 is then turned on to lower the node N1to the level “LOW” when the NMOS transistor 202 is turned on (FIG. 58).

As disclosed above, the retrieved data is stored in the first latch 1 asuch that the node N1 is set at the level “LOW” when the second bit is“1” whereas “HIGH” when the second bit is “0”.

The data in the first latch 1 a is then transferred to the second latch2 a (step S33), and output via the data input/output terminals I/O.

The multilevel retrieval operation is achieved as disclosed.

The two-level retrieval operation is achieved with the second latch 2 aas a cache memory. The re-programming/retrieval circuit 10 having thefirst latch 1 a is a main buffer. The two-level operation performs datatransfer only through the second latch 2 a. The retrieval operationapplies a retrieval voltage within the two-level data threshold leveldistribution to a selected word line to perform the operation same asthe retrieval “Read00” shown in FIGS. 47B and 55. The programmingoperation is performed like shown in FIG. 9A.

As disclosed in the foregoing embodiment, the retrieval operation movesonto the succeeding page retrieval using the main page buffer 10 afterthe anterior retrieved data has been transferred from the first latch 1a to the second latch 2 a. The programming operation loads the data tobe programmed on the succeeding page address to the second latch 2 aafter the anterior data to be programmed has been transferred from thesecond latch 2 a to the first latch 1 a. These retrieval/programmingoperations achieves a caching function.

The transistor size of the NMOS transistors 201 to 204 used forinversion of data stored in an active first latch 1 a is one of theimportant factors in FIG. 46. In FIG. 46, different from FIG. 2, theresult of bit line-data sensing “HIGH” or “LOW” is supplied to the gateof the NMOS transistor 201. The level “HIGH” the sense node N4 b whiledata sensing corresponds to Vdd whereas “LOW” is almost equal to bitline potential after dis-charged when a selected cell is turned on. TheNMOS transistor 201 must meet the requirements in that it is turned onin a considerably low impedance state when the sense node N4 b is set atthe level “HIGH” whereas turned off or at least in a considerably highimpedance state when the node N4 b is set at the level “LOW”. Anotherimportant requirement is a small turn-on resistance for the NMOStransistors 201 to 203 for ensuring inversion of data stored in thefirst latch 1 a.

A sufficient wide margin of sensing is, however, hard to achieve only bydesign of transistor size discussed above. It is achieved by potentialcontrol at the node N4 b with capacitance-coupling using the capacitor48 shown in FIG. 46 in addition to the design of transistor size. Indetail, after bat line pre-charging via the NMOS transistor 47 b, apositive potential, for example, is applied to the terminal CAPG toboost the sense node N4 b so that the channel resistance ratio of theNMOS transistor 201 between the _37 HIGH” and “LOW” output, thusattaining a wide margin of sensing.

As already disclosed, in the page buffer 140 shown in FIG. 2, the mainbuffer 10 having the first latch 1 a is made up of a sense amplifier.NAND-type flash memories are easy to be assembled for mass storagewhereas produce a small current from their cells, thus being interior toNOR type on high-speed retrieval. NAND-type flash memories thus usuallysimultaneously retrieve 1-page memory cell data, for example, 512 bytes,selected through one word line, and serially transfer and out theretrieved data. These operations require sense amplifiers for 512 bytesto 512-byte memory cells.

The sense amplifier performs bit line-potential clamping and pre-sensingoperation using the clamp transistor 41 shown in FIG. 2, to achievehigh-speed retrieval as high as possible. The clamping operation,however, results in a narrow margin of “0” or “1”-data sensing. Thelower the power supply voltage, or the lower threshold level of thefirst latch 1 a, the narrower the margin of sensing.

Such a narrow margin of sensing is discussed in detail with respect toFIG. 59 illustrating several sensing waveforms.

In retrieval, a retrieval voltage is applied to a selected word lineconnected to a NAND-type cell block whereas a retrieval “pass”-voltageis applied to the other non-selected word lines, for handlingseries-connected cells as “pass” transistors. Here, “pass” meanscompletion of a data programming as already explained.

Bit line dis-charging through the source-side gate-selection line SGS(FIG. 3) of a NAND-type cell is performed as follows:

The drain-side gate selection line SGD is always on whereas thesource-side gate-selection line SGS is always off to perform bit linepre-charging (from moments T0 to T1 in FIG. 59). In other words, theclamp transistor 41 and the pre-charging transistor 47 (FIG. 2) areturned on to perform pre-charging.

As shown in FIG. 59, a potential BLPRE (Vdd+Vtn) boosted from the powersupply voltage Vdd is applied to the gate of the pre-charging transistor47 to apply Vdd to the sense node N4. Moreover, the potential BLCLAMP atthe gate of the clamp transistor 41 is set at Vpre to re-charge. The bitline To (Vpre−Vtn). The potential Vtn as a Threshold level of NMOStransistors.

The potential BLCLAMP is then returned to 0V to turn on the source-sidegame-selection line SGS, thus the bit line is dis-charged or holding thepre-charged potential instead, in accordance with the data of a selectedcell.

At a moment T2 (FIG. 59), the potentials SEN and LAT are set at thelevel “LOW” to dis-activate the first latch 1 a, and then the NMOStransistor 42 is turned on to connect the sense node N4 and the node N1of the first latch la, thus pre-charging the node N1 at Vdd.

At a moment T3, the pre-charging transistor 47 is turned on to bring thenode N1 in a floating state. The potential BLCLAMP at the gate of theclamp transistor 47 is set at a retrieval potential Vsen during theperiod from moments T4 and T5 while the node N1 is being set in thefloating state.

When data programmed in a selected cell is “1”, the bit line potentialahs been lowered below (Vsen−Vtn), thus the nodes N1 and N4 beinglowered to the bit line potential while the clamp transistor 41 beingturned on.

On the other hand, when data programmed in a selected cell is “0”, thebit line holds the pre-charged potential, the nodes N1 and N4 holdingthe pre-charge potential Vdd while the clamp transistor 41 is beingturned off.

As a result, for a “1”-programmed cell, the bit line voltage (Vpre−Vsen)is amplified to Vdd−(Vpre−Vsen) at the nodes N1 and N4 and retrieved.For example, a 0.7V-bit line pre charged potential and about a 0.25V-bitline-retrieval voltage produce the potential at the nodes N1 and N4amplified to about 2V.

After the clamping operation, the potential at the node Al is set at thelevel “HIGH” or “LOW” and stored in the first latch 1 a. A usualretrieval operation activates the clocked inverter CI2 (FIG. 2) of thefirst latch 1 a at a moment T7, and then activates the clocked inverterCI1 at a moment T8, for data retrieval.

Accordingly, after bit line amplification by clamping operation, the“LOW”-level potential (waveform “q” in FIG. 59) appearing at the nodesN1 and N4 is required to be lower than the threshold level of the firstlatch 1 a. In other words, the threshold level of the first latch 1 a isrequired to be higher than the potential, the level “LOW”, appearing atthe nodes N1 and N4. Therefore, the levels “HIGH” and “LOW” on the bitline in retrieval meet a requirement that a threshold level of theclocked inverters dropped to a lowest level due to decrease in powersupply voltage will not cause a retrieval error.

On the other hand, the lower the bit line pre-charging potential inretrieval, the smaller the cell current because a cell current dependson drain voltage, thus the longer the retrieval time. Increase inturn-on current of a “1”-programmed cell for high-speed retrieval willbe restricted by a threshold level of the first latch 1 a, thusrequiring sense amplifier circuit configuration in which the thresholdlevel of sense amplifier will not restrict bit line pre-chargingpotential or voltage.

Disclosed next are modifications to a sene amplifier applicable to themain page buffer 10 (FIG. 2) in consideration of the requirementsdiscussed above.

The modifications to sense amplifier disclosed below are applicable tothe foregoing embodiments for achieving multilevel operation and cachingfunction, and also to usual two-level NAND-type flash memories.

Moreover, the modifications are applicable to any nonvolatile memoriesthat perform data storing in accordance with existence of a bit linecurrent or its level, in addition to electrically erasable non-volatilememories.

The modifications will be disclosed as being used in two-level dataretrieval in NAND-type flash memories.

(First Modification)

FIG. 60 shows a circuit diagram of the first modification to senseamplifier, which is applicable to the page buffer 10 shown in FIG. 2.

A bit line selection switch 141 b selects either the bit line BLo or BLeto be connected to a sense amplifier 141 a The first latch 1 a havingthe clocked inverters CI1 and CI2 stores retrieved 1-page memory celldata until serial transfer for data output. In programming, the latch 1a stores data to be programmed for each page until the programming iscompleted.

FIG. 61 illustrates the connection of the sense amplifier 141 a and acell array having two NAND cell blocks 101 and 102.

Sense amplifiers (P/B) 141 a each for one page are connected to the bitline BLo or BLe via corresponding selection switches (BLS) 141 b Thesense amplifiers 141 a are connected to the data input/output buffer 50a via the column gate 150. The data stored in the sense amplifiers 141 aare converted into serial data for retrieval by the column gate 150 thatis switched by a column address.

Like shown in FIG. 2, the sense node N4 is connected to a selected bitline via the clamp NMOS transistor 41, the pre-charging NMOS transistor47 is connected to the node N4, and the transfer NMOS transistor 42 isprovided between the node N4 and the node N1 (the input terminal of theclocked inverter CI2) of the first latch 1 a. A verify circuit 20corresponds to the transistors 44 to 46 and the capacitor 49 in FIG. 2.

Connected to the sense node N4 is a capacitor 48 c having a terminalBOOST2 used for potential control of the node n4 withcapacitance-coupling in data sensing.

FIG. 62 illustrates waveforms in data sensing by the sense amplifier 141a.

At a moment T0, the potential BLPRE at the gate of the pre-chargingtransistor 47 is set at (Vdd+Vtn) and simultaneously the potentialBLCLAMP at the gate of the clamp transistor 41 is set at Vpre, topre-charge a selected bit line from the sense amplifier 141 a while thetransistor 42 is being turned off, the first latch 1 a being active.This pre-charging operation sets the sense node N4 in the senseamplifier 141 a at Vdd and the selected bit line at (Vpre−Vtn).

At a moment T2, the clamp transistor 41 is turned off to turn on aselection gate of a NAND cell to dis-charge the bit line in accordancewith data of the selected cell. Also at the moment T2, the potentialBLCD at the gate of the NMOS transistor 42 is set at (Vdd+Vtn) to turnon the transistor 42 after bit line dis-charging has been started.Moreover, the potentials SEN and LAT at the gates of the NMOStransistors 18 and 14, respectively, are set at the level “LOW” todis-activate the first latch 1 a, thus the node N1 being charged to Vdd.

At a moment T3, the potential BLPRE at the gate of the NMOS transistor47 is set at 0V to turn off the pre-charging transistor 47 while thefirst potential at the terminal BOOST of the capacitor 48 c is beingraised to the second potential, for example, from 0V to 1V.

Since the node N4 has been in a floating state, the potential at thenode N4 is raised due to capacitance-coupling. This potential increaseis determined in accordance with a capacitance ratio between thecapacitor 48 c and the node N4.

On the other hand, the potential at the node N1 is raised at most Vddbecause the potential BLCD at the gate of the transistor 42 has been setat (Vdd+Vtn), thus potential increase due to capacitance-coupling beingnot allowed.

A capacitor, that corresponds to the capacitor 48 c, is generally usedfor suppressing leak current or parasitic capacitance when the node N4is held in a floating state but not for voltage boosting like thismodification.

At a moment T4, the potential BLCLAMP at the gate of the clamptransistor 41 is set at Vsen to connect a selected bit line and thesense node N4.

Potential change (a) to (d) at the sense node N4 is illustrated in FIG.62, which corresponds to bit line potential change in accordance withdata of a selected cell.

The change (a) indicates potential change at the node N4 to programmeddata “0” for which the selected cell has a considerably high thresholdlevel, in which the bit line potential is almost clamped at apre-charging potential, thus the clamp transistor 41 being not turned onto clamp a boosted potential at the node N4.

The change (b) indicates potential change at the node N4 to programmeddata “0”, for which the selected cell has a threshold level close to aselected word line potential, in which a sub-threshold current flows,the bit line potential and also the potential at the node N4 beingslightly lowered.

The change (C) indicates potential change at the node N4 to programmeddata “1” for which the selected cell has a high threshold level, inwhich bit line dis-charging is delayed, the potential at the node N4being intermediate level like on a selected bit line.

Moreover, the change (d) indicates potential change at the node N4 toprogrammed data “1” for which the selected cell has a considerably lowthreshold level, in which the node N4 is connected to a selected bitline, the potential on which being discharged to almost 0V, thus thenode N4 being dis-charged to almost 0V like the bit line.

The operation at the moment T4 is one of the features of thismodification in which bit line potential is amplified with a highpotential at the node N4.

At a moment T5, the potential BLCLA at the gate of the clamp transistor41 is varied to Vsup that is slightly lower than Vsen but higher thanthe threshold level, to turn on the transistor 41 almost at 0V. Thispotential change does not allow the node N4 to be connected to theselected bit line unless the potential on the bit line is lower thanwhen the potential Vsen is applied.

At a moment T6, the potential at the terminal BOOST2 is returned To 0V.The decrease in gate voltage to the clamp transistor 41 makes it hardfor the node N4 to be connected to the selected bit line, thus the noden4 being easily be brought into a floating state.

In the change (a) to (c), the potential at the node N4 is lowered inaccordance with potential drop at the terminal BOOST2. On the otherhand, in the change (d) in which the potential at the node N4 is set atalmost 0V after the moment T4, the node N4 would be lowered to anegative potential, if the node N4 is in the floating state, which is,however, protected from being lowered to a negative level because acurrent flows to the node N4 from the selected line via the clamptransistor 41. Such protection of potential decrease is achieved by thecapacitance 48 c whose capacity is smaller than the bit linecapacitance.

As disclosed above, in “0”-data retrieval in accordance with the change(a), the potential at the node N1 returns to Vdd that is the potentialbefore boosting by the capacitor 41. On the other hand, in “1”-dataretrieval in accordance with the change (c) for which bit linedis-charging is slow, the potential at the node N1 is dropped to apotential lower than the bit line potential.

Accordingly, the sense amplifier in this modification performs nor onlyamplifying the potential at the node N1 higher than the bit line voltagebut also to lower which is equivalent to amplification to lowerpotential, thus achieving a big difference between levels “HIGH” and“LOW” at the node N1.

At a moment T7, the potential BLCLAMPO at the gate of the clamptransistor 41 is set at 0V to completely disconnect the node N4 from thebit line.

At a moment T9, the clocked inverter CI2 is activated, and at a momentT10, the clocked inverter CI1 is activated, to load two-level data“HIGH” and “LOW” at the node N1 to the first latch 1 a.

FIG. 62 indicates the range of threshold level (inverted thresholdlevel) of the CMOS clocked inverters CI1 and CI2 of the first latch 1 ain consideration of variation in power supply Vdd and process.

In this modification (FIG. 60), the potential at the node N4 is boostedvia the capacitor 48 c to sense a bit line data by a clamping operation,and then the potential at the node N4 is lowered in which the level“LOW” at the node N4 in retrieval of “1”-programmed cell is loweredbelow the lit line potential level.

The modification, thus, achieves correct retrieval with no error eventhe potential level “LOW” on the bit line is higher than the thresholdlevel the clocked inverters CI1 and CI2 of the first latch 1 a.

A higher voltage level to the capacitor 48 c offers higher set valuesfor “HIGH”-level pre-charging potential on the bit line and thepotential for “LOW”-level retrieval, etc.

In FIG. 60, the potential BLCD to be applied at the gate of the NMOStransistor 42 connected between the nodes N1 and N4 is set at (Vdd+Vtn)to boost the potential only at the node N4 because the node N1 isconnected to the drain of the PMOS transistor 13 of the first latch 1 a.

This potential application is one requirement for the first modificationbecause if the potentials at the nodes N1 and N4 were simultaneouslyboosted, it would bring the pn-junction of the PMOS transistor 13 into aforward-biased state so that the potential at the node N4 is notboosted.

Another requirement for this modification is that the voltage BLCDapplied to the gate of the NMOS transistor 42 is higher than thethreshold level of the clocked inverters CI1 and CI2 of the first latch1 a for transferring a voltage lower than Vdd, in other words, notnecessarily be (Vdd+Vtn).]

A control signal REG to be applied at a moment T8 in FIG. 62 is used forretrieval operation, such as, retrieval for programming verification. InFIG. 60, the control signal REG is applied to the gate of the NMOStransistor 43 connected between the node N4 and the verify circuit 20.

In detail, the control signal REG is used in repeated programming pulseapplying operation and retrieval operation for programming verificationto keep the threshold range of data to be programmed in a given rangefor data programming per page in NAND-type flash memories.

For each bit on which programming has been completed, data is set forprohibiting programming at the succeeding programming pulse applyingoperation.

In detail, at “0”-data programming, a selected bit line is pre-chargedat the level “LOW” at the node N1. The node N1 is set at the level“HIGH” in retrieval for programming verification on a “0”-programmed bitwhen “0”-programming (electron injection to the floating gate) has beensufficient. The level “HIGH” at the node N1 prohibits the succeedingprogramming. Insufficient “0”-programming will result in the level “LOW”at the node N1, thus “0”-programming is performed again to a bit onwhich “0”-programming has been insufficiently performed.

On the other hand, at “1”-data programming (for prohibition ofprogramming), a selected bit line is pre-charged at the level “HIGH” atthe node N1 and held at the level. The retrieval operation forprogramming verification results in the level “LOW” at the node N1. Bitline pre-charging at this level for the succeeding programming resultsin “0”-programming. This requires inversion of the data at the node N4to the level “HIGH” (programming prohibition) in retrieval operation forprogramming verification.

These potential control at the nodes N1 and N4 are performed by theverify circuit 20. The circuit 20 sets the level “HIGH,” at the nodes N1and N4 when the level “HIGH” is applied as the control signal REG to thegate of the SMOS transistor 43 only when the potential at the node N1 is“HIGH” at the moment of programming pulse applying operation

(Second Modification)

FIG. 63 shows a circuit diagram of the second modification to senseamplifier.

Elements in this modification that are the same as or analogous toelements in the first modification (FIG. 60) are referenced by the samereference numbers and will not be explained in detail.

The difference between the first and the second modifications is thatthe latter is provided with a capacitor 48 a, one of the terminalsthereof being grounded, in addition to the capacitor 48 c for applying aboosted potential to the sense node N4.

The second modification requires a drive voltage to be applied to theterminal BOOST2 of the capacitor 48 c higher than that for the firstmodification to attain the same boosted voltage at the Node N4 becausecapacitance at the node N4 is larger than that for the capacitor 48 awhen the potential at the node N4 is boosted.

In other words, in FIG. 60, an intermediate drive voltage is requiredfor attaining a desired boosted voltage at the node N4 whereas, in FIG.63, the power supply voltage Vdd can be used as a boosting drive voltagewhich depends on selection of capacitance to the capacitors 48 a and 48c A voltage range from 0V to Vdd to the terminal BOOST2 of the capacitor48 c offers simple circuit configuration.

(Third Modification)

FIG. 64 shows a circuit diagram of the third modification to senseamplifier.

Elements in this modification that are the same as or analogous toelements in the foregoing modifications are referenced by the samereference numbers and will not be explained in detail.

The difference between the second and the third modifications is thatthe latter is provided with a PMOS transistor 82 b (as a pre-chargingcircuit) that is controlled by a control signal PPRE applied to its gateand a capacitor 48 b connected to the Node N1, one of the terminalsbeing grounded, for clamping a potential at the node N1.

In FIG. 60, the voltage (Vdd+Vtn) is applied to the gate of the NMOStransistor 42 in boosting the potential at the node N4 under the controlat the terminal BOOST2 of the capacitor 48 c, so as not to raise thepotential at the node N1.

The voltage (Vdd+Vtn) must be precise, otherwise the pn-junction of thePMOS transistor 13 of the first latch 1 a will be brought into aforward-biased state, which obstructs the potential at the node N4 to beboosted. This requires a controlled voltage BLCD applied to the gate ofthe NMOS transistor 42 to attain the potential at the node N1 lower thanVdd but higher than the threshold level of the first latch 1 a.

Contrary to the first modification, the third modification (FIG. 64)enables pre-charging of the node N1 with no relation to the node N4 forsimplified control of the NMOS transistor 42 as discussed above. Thevoltage BLCD applied to the gate of the transistor 42 may be a voltagefor transferring the potential at the node N4, which is appeared whenthe node N4 is connected to a selected bit line by clasping operation,to the node N1, or higher than Vsen applied to the gate of the NMOStransistor 41. The power supply voltage Vdd is, for example, applied asthe voltage BLCD to the gate of the transistor 42 at a given timing.

FIG. 65 illustrates signal waveforms in the third modification.

The bit line pre-charging operation for the period from a moment T0 toT1 is the same for the first modification in FIG. 60. At a moment T2,the control signal PPRE at the gate of the PMOS transistor 82 b (FIG.64) is set at “LOW” (Vss) to pre-charge the node N1 to Vdd while thesignal BLCD at the gate of the NMOS transistor 42 is the level “LOW”,thus the node N1 being pre-charged with no relation to the node N4. At amoment T3, the signal BLCD is set at a level, Vdd, etc. higher than Vsenapplied to the gate of the NMOS transistor 41. The NMOS transistor 42 isturned off when the signal BLCD and the potentials at the nodes N1 andN4 are all Vdd while the potential at the node N4 is being boosted viathe terminal B003T2 of the capacitor 48 c.

In FIG. 64, like shown in FIG. 63, the two capacitors 48 a and 48 c areused for boosting the potential at the node N4, however, the capacitor48 c only is essential like shown in FIG. 60.

At a moment T4 in FIG. 65, the pre-charging control signal PPRE is setat the level “HIGH” to stop pre-charging to the node N1, thus the nodeN1 being in a floating state. This operation offers a sharp cut-offcharacteristics to the NMOS transistor 42 to stably raise the potentialat the node N4.

At a moment T8, the signal BLCD applied to the gate of the NMOStransistor 42 is raised to (Vdd+Vtn) before activating the first latch 1a, for re-charging the potentials at the nodes N1 and N4 to the level“HIGH” after they are discharged, in retrieval for verification of“0”-programming.

(Fourth Modification)

FIG. 66 shows a circuit diagram of the fourth modification to senseamplifier.

Elements in this modification that are the same as or analogous toelements in the foregoing modifications are referenced by the samereference numbers and will not be explained in detail.

The fourth modification requires no potential boosting at the node N4.The capacitors 48 a and 48 b are connected to the nodes N4 and N1,respectively. One of the terminals of each capacitor is grounded. Alsoconnected to the node N1 is a resetting NMOS transistor 82 c.

FIG. 67 illustrates signal waveforms in the fourth modification.

Bit line-data sensing is performed by bit line pre-charging and clampingoperation in this modification with no boosting the potential at thenode N4 while the signal BLCD is 0V, thus the NMOS transistor 42 beingturned off. The node N4 and a selected bit line is connected by theclamping operation After a bit line potential appears at the node N4,the voltage (Vdd+Vtn) is applied as the signal BLCD to the gate of theNMOS transistor 42 at a moment TS. Before the moment T5, a resettingsignal NRST has been set at the level “HIGH” to reset the node N1 to 0V.

Under the control disclosed above, the NMOS transistor 42 is turned onto distribute charges stored in the capacitor 48 a to the capacitor 48b. This charge distribution lowers the potential at the node N4 whileraises the potential at the node N4, thus the level “LOW”, the bitline-data, can be retrieved at the node N4 as “LOW” even though thelevel “LOW” is higher than the threshold level of the first latch 1 a.

The sense amplifier 141 d in the fourth embodiment is simple in itsoperation compared to the sense amplifiers 141 a, 141 b and 141 c inFIGS. 60, 63 and 64, respectively.

On the other hand, at the moment T5 in FIG 67, a level “HIGH” at thenode N1 decided by charge distribution from the node N4 too low, orlower than the threshold level of the first latch 1 a results in failurein “0”-data retrieval. Thus, compared to the circuits in FIGS. 60, 63and 64, the sense amplifier 141 d in FIG. 66 has a low flexibility inbit line potential settings for retrieval operation.

(Fifth Modification)

FIG. 68 shows a circuit diagram of the fifth modification to senseamplifier.

Elements in this modification that are the same as or analogous toelements in the foregoing modifications are referenced by the samereference numbers and will not be explained in detail.

In the foregoing modifications in FIGS. 60, 63, 64 and 66, the data atthe node N4 is directly transferred to the node N1 of the first latch 1a via the NMOS transistor 42.

On the other hand, in FIG. 68, the node N4 is connected to the gate of asense transistor NMOS 70, thus the data at the node N4 being transferredto the node N1 via the transistor 70The source of the transistor 70 isgrounded while the drain is connected to the nodes N1 and N2 viaswitching transistors 71 and 72.

Also connected to the node N4 is the boosting capacitor 48 c having theterminal BOOST2, like shown in FIG. 60,

A usual retrieval operation in this modification is explained withrespect to FIG. 69 illustrating signal waveforms.

At a moment T0, the voltage (Vdd+Vtn) is applied as the potential BLPREat the gate of the discharging NMOS transistor 47 while applying Vpre asthe potential BLCLAMP at the gate of the clamp transistor 41, topre-charge a selected bit line to (Vpre−Vtn), thus Vdd appearing at thenode N4. A control signal BLSEN0 is simultaneously set at Vdd to resetthe potentials at the nodes N1 and N2 of the first latch 1 a at thelevels “HIGH” and “Low”, respectively.

Bit line pre-charging is completed at a moment Ti. Then, a selectiongate of a NAND cell block is turned on in which the selected bit line ishard to dis-charge or not dis-charged, which depends on data of aselected cell, thus the bit line holding the pre-charged potential. Thepre-charging transistor 47 has been turned on by a moment T2. It is thenturned off, and at a moment T3, the potential at the terminal BOOST2 ofthe capacitor 48 c is raised by, for example, 1V, to boost the potentialat the node N4 by capacitance-coupling.

At a moment T4, the potential BLCLAMP at the gate of the clamptransistor 41 is set at Vsen to retrieve bit line potential in the rangeof (Vpre−Vsen) while the potential at the node N4 indicates potentialchange (a) to (d), compared to those shown in FIG. 62.

In this modification, the NMOS transistor 72 is turned on in the change(a) and (b) while turned off in the change (c) and (d).

The control signal BLSEN1 is set at Vdd to turn on the NMOS transistor71, thus the node N1 of the first latch 1 a being inverted to the level“LOW” in the change (a) and (b) while the node N2 being clamped at thelevel “HIGH” in the change (c) and (d).

The potential at the node N4 is boosted in data sensing in the senseamplifier of this modification. This potential control offers a smallsize for the transistors 70 to 72 which may otherwise tend to be largedue to forcible inversion of the first latch la.

The fifth modification loads data into the first latch 1 a while thepotential at the node N4 is being boosted as indicated in FIG. 69.However, like the first modification of FIG. 60, data may be loaded intothe first latch 1 a after the potential at the node N4 is released fromboosting. Moreover, like the second modification of FIG. 63, besides theboosting capacitor 48 c, another capacitor (one of the terminals beinggrounded) may be connected to the node N4.

FIGS. 70A to 70C illustrate the capacitors 48 c, 48 a and 48 b,respectively, used in the foregoing modification.

Illustrated in FIG. 70A is a MOS capacitor using a D-type NMOStransistor, The gate may be connected to the node N4 or N1 and the drainand source are both connected as the terminal BOOST2 or ground terminalin the foregoing modifications. It is preferable that the transistor isturned on even when the potential at the terminal BOOST2 is raised from0V to a positive potential.

Illustrated in FIG. 70B is a capacitor formed between a firstlayer-polycrystal silicon 515 and a second layer-polycrystal silicon514. This type of capacitor is applicable to non-volatile memory cellsbecause these cells usually have a stacked-gate structure.

Illustrated in FIG. 70C is a capacitor formed between an n-type well 517and an electrode 515 formed over the well via an insulating film. Then-type well 517 is formed with an n⁺-type diffusion layer 516 that isconnected to the terminal BOOST2 in the foregoing modifications. It ispreferable that an n-type layer 518 of density higher than the n-typewell 517 is formed thereon to attain a stable capacitance withoutrespect to the potential at the terminal BOOST2.

As disclosed above, according to the present invention, are-programming/retrieval circuit (page buffer) having two latchesachieves high-speed programming speed by caching function and largestorage capacity by multilevel function in flash EEPROMS.

1. A non-volatile semiconductor device comprising: a memory cell arrayhaving electrically erasable programmable non-volatile memory cells; aplurality of reprogramming and retrieval circuits that temporarily storedata to be programmed in the memory cell array and sense data retrievedfrom the memory cell array, each reprogramming and retrieval circuithaving a first latch and a second latch that are selectively connectedto the memory cell array and transfer data to each other; and acontroller that controls the reprogramming and retrieval circuits ondata-reprogramming operation to and data-retrieval operation from thememory cell array, wherein each reprogramming and retrieval circuit hasa multilevel logical operation mode and a caching operation mode, in themultilevel logical operation mode, re-programming and retrieval of upperand lower bits of two-bit four-level data being performed using thefirst and the second latches in storing the two-bit four-level data inone of the memory cells in a predetermined threshold level range, in thecaching operation mode, data transfer between one of the memory cellsselected in accordance with a first address and the first latch beingperformed while data transfer is being performed between the secondlatch and input/output terminals in accordance with a second addresswith respect to one-bit two-level data to be stored in one of the memorycells.
 2. The non-volatile semiconductor device according to claim 1,wherein the multilevel logical operation mode and the caching operationmode are switched by command entry.
 3. The non-volatile semiconductordevice according to claim 1, wherein the multilevel logical operationmode and the caching operation mode are executed as partiallyoverlapping each other in accordance with an address of the data.
 4. Thenon-volatile semiconductor device according to claim 1, wherein eachreprogramming and retrieval circuit includes: a sense node connected toa selected bit line via a clamp transistor; a pre-charging circuit forpre-charging the bit line connected to the sense node via the clamptransistor; a transfer transistor connected between the sense node andthe first latch; and a boosting capacitor, a first terminal thereofbeing connected to the sense node, the capacitor boosting a potential atthe sense node using a second terminal.
 5. The non-volatilesemiconductor device according to claim 1, wherein each reprogrammingand retrieval circuit includes: a sense node connected to a selected bitline via a clamp transistor; a pre-charging circuit for pre-charging thebit line connected to the sense node via the clamp transistor; a sensetransistor, a source thereof being supplied with a reference potential;a transfer transistor connected between a drain of the sense transistorand the first latch; and a boosting capacitor, a first terminal thereofbeing connected to the sense node, the capacitor boosting a potential atthe sense node using a second terminal.
 6. The non-volatilesemiconductor device according to claim 1, wherein, in the cachingoperation mode, resetting of the second latch is performed after datatransfer from the second latch to the first latch.
 7. The non-volatilesemiconductor device according to claim 1, wherein the four-level datais defined as “11”, “10”, ”00” and “01” from lower level of thethreshold level range.
 8. The non-volatile semiconductor deviceaccording to claim 1, wherein different row addresses are allocated tothe upper and the lower bits of the four-level data for programming andretrieval.
 9. The non-volatile semiconductor device according to claim8, wherein a first and a second data programming operation are performedin the multilevel logical operation mode, in the first data programmingoperation, the lower-bit data being loaded into the second latch andthen stored in the first latch, programming being performed to aselected memory cell based on the data stored in the first latch, in thesecond data programming operation, the upper-bit data being loaded intothe second latch and then stored in the first latch while lower-bit dataalready programmed in the selected memory cell is being retrieved andloaded into the second latch, programming being performed to theselected memory cell based on the data stored in the first latch inaccordance with the data stored in the second latch.
 10. Thenon-volatile semiconductor device according to claim 8, wherein a first,a second and a third retrieval operation are performed in the multilevellogical operation mode, in the first retrieval operation, “0” or “1” ofthe upper bit being judged using a retrieval voltage applied at acontrol gate of a selected memory cell, the retrieval voltage being setin a threshold level range of “10” and “00” as the four-level data, inthe second retrieval operation, “0” or “1” of the lower bit when theupper bit is “1” being judged using a retrieval voltage applied at thecontrol gate of the selected memory cell, the retrieval voltage beingset in a threshold level range of “00” and “01” as the four-level data,and in the third retrieval operation, “0” or “1” of the lower bit whenthe upper bit is “1” being judged using a retrieval voltage applied atthe control gate of the selected memory cell, the retrieval voltagebeing set in a threshold level range of “11” and “10” as the four-leveldata.
 11. The non-volatile semiconductor device according to claim 1,wherein each reprogramming and retrieval circuit is selectivelyconnected to a plurality of bit lines of the memory cell array via a bitline selection switch.
 12. The non-volatile semiconductor deviceaccording to claim 1, wherein a data programming cycle for a selectedmemory cell of the memory cell array is performed by repeatedprogramming pulse application and retrieval for programmingverification, in a test mode, a cell current flowing in the selectedmemory cell being retrieved to the input and output terminals while thedata programming cycle being interrupted during which the data retrievedby the retrieval for programming verification is being stored in thefirst latch and the second latch is being inactive.